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题名: Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
作者: H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
发表日期: 2013
刊名: Journal of Materials Science & Technology
相关网址: <Go to ISI>://WOS:000315064900002
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
H. F. Zhou,J. D. Guo,Q. S. Zhu,et al. Application Of Electroless Fe-42ni(p) Film For Under-bump Metallization On Solder Joint[J]. Journal Of Materials Science & Technology,2013,29(1):7-12.

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