Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

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	Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
	H. F. Zhou; J. D. Guo; Q. S. Zhu; J. K. Shang
	2013
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	29 期号:1 页码:7-12
摘要	Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).
部门归属	[zhou, haifei ; guo, jingdong ; zhu, qingsheng ; shang, jianku] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; guo, jd (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; jdguo@imr.ac.cn ; jkshang@imr.ac.cn
关键词	Under-bump Metallization (Ubm) Electroless Fe-42ni(p) Sn Solderability Interfacial Reaction Fe-p Solderability Deposition Alloys Sn Behavior Systems Surface Cu
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71741
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zhou,J. D. Guo,Q. S. Zhu,et al. Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint[J]. Journal of Materials Science & Technology,2013,29(1):7-12.
APA	H. F. Zhou,J. D. Guo,Q. S. Zhu,&J. K. Shang.(2013).Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint.Journal of Materials Science & Technology,29(1),7-12.
MLA	H. F. Zhou,et al."Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint".Journal of Materials Science & Technology 29.1(2013):7-12.