|Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate|
|F. F. Tian; Z. Q. Liu
|Source Publication||Journal of Alloys and Compounds
|Abstract||The growth mechanism of duplex structural Cu-2(In,Sn) compound formed between eutectic SnIn solder and single crystalline Cu during reflowing and solid-state aging were systematically investigated using a top-view technique. The fine-grain Cu-2(In,Sn) had a granular morphology and distributed homogeneously without any growth orientation, while textured coarse-grain Cu-2(In,Sn) displayed preferential growth on different Cu surface planes. It was observed that on (100) or (111) single crystalline Cu substrates, the coarse-grain Cu-2(In,Sn) compound had regular and elongated shuttle-type morphology along two perpendicular (90 degrees) or three intersecting (120)< 011 >(Cu) directions, respectively. But on (102)Cu surface the grains grew like elongated stripes along only one < 010 >(Cu) direction. Electron beam backscattered diffraction (EBSD) revealed the growth orientation relationships between them, which are (Cu2(In,Sn))//< 011 >(Cu) on (100)Cu and (111)Cu, and [1 - 100](Cu2(In,Sn))//< 010 >(Cu) on (102)Cu surface. These orientation relationships enable the minimum misfit (2.3-2.9%) of the array of Cu atoms between coarse-grain Cu-2(In,Sn) compound and single crystalline Cu substrate. (C) 2013 Elsevier B. V. All rights reserved.|
; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.
; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.
F. F. Tian,Z. Q. Liu. Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,588:662-667.
F. F. Tian,&Z. Q. Liu.(2014).Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate.Journal of Alloys and Compounds,588,662-667.
F. F. Tian,et al."Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate".Journal of Alloys and Compounds 588(2014):662-667.
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