| Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate | |
| F. F. Tian; Z. Q. Liu | |
| 2014 | |
| Source Publication | Journal of Alloys and Compounds
 |
| ISSN | 0925-8388 |
| Volume | 588Pages:662-667 |
| Abstract | The growth mechanism of duplex structural Cu-2(In,Sn) compound formed between eutectic SnIn solder and single crystalline Cu during reflowing and solid-state aging were systematically investigated using a top-view technique. The fine-grain Cu-2(In,Sn) had a granular morphology and distributed homogeneously without any growth orientation, while textured coarse-grain Cu-2(In,Sn) displayed preferential growth on different Cu surface planes. It was observed that on (100) or (111) single crystalline Cu substrates, the coarse-grain Cu-2(In,Sn) compound had regular and elongated shuttle-type morphology along two perpendicular (90 degrees) or three intersecting (120)< 011 >(Cu) directions, respectively. But on (102)Cu surface the grains grew like elongated stripes along only one < 010 >(Cu) direction. Electron beam backscattered diffraction (EBSD) revealed the growth orientation relationships between them, which are [0001](Cu2(In,Sn))//< 011 >(Cu) on (100)Cu and (111)Cu, and [1 - 100](Cu2(In,Sn))//< 010 >(Cu) on (102)Cu surface. These orientation relationships enable the minimum misfit (2.3-2.9%) of the array of Cu atoms between coarse-grain Cu-2(In,Sn) compound and single crystalline Cu substrate. (C) 2013 Elsevier B. V. All rights reserved. |
| description.department | [tian, feifei ; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn |
| Keyword | 48sn52in Imc Morphology Orientation Relationship Ebsd Interfacial Reactions Soldering Reaction Joint Reliability Void Formation Solid-state Sn Cu3sn Alloy Creep |
| URL | 查看原文 |
| Language | 英语 |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/72497 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | F. F. Tian,Z. Q. Liu. Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,588:662-667. |
| APA | F. F. Tian,&Z. Q. Liu.(2014).Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate.Journal of Alloys and Compounds,588,662-667. |
| MLA | F. F. Tian,et al."Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate".Journal of Alloys and Compounds 588(2014):662-667. |
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