Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate

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	Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate
	F. F. Tian; Z. Q. Liu
	2014
发表期刊	Journal of Alloys and Compounds
ISSN	0925-8388
卷号	588 页码:662-667
摘要	The growth mechanism of duplex structural Cu-2(In,Sn) compound formed between eutectic SnIn solder and single crystalline Cu during reflowing and solid-state aging were systematically investigated using a top-view technique. The fine-grain Cu-2(In,Sn) had a granular morphology and distributed homogeneously without any growth orientation, while textured coarse-grain Cu-2(In,Sn) displayed preferential growth on different Cu surface planes. It was observed that on (100) or (111) single crystalline Cu substrates, the coarse-grain Cu-2(In,Sn) compound had regular and elongated shuttle-type morphology along two perpendicular (90 degrees) or three intersecting (120)< 011 >(Cu) directions, respectively. But on (102)Cu surface the grains grew like elongated stripes along only one < 010 >(Cu) direction. Electron beam backscattered diffraction (EBSD) revealed the growth orientation relationships between them, which are [0001](Cu2(In,Sn))//< 011 >(Cu) on (100)Cu and (111)Cu, and [1 - 100](Cu2(In,Sn))//< 010 >(Cu) on (102)Cu surface. These orientation relationships enable the minimum misfit (2.3-2.9%) of the array of Cu atoms between coarse-grain Cu-2(In,Sn) compound and single crystalline Cu substrate. (C) 2013 Elsevier B. V. All rights reserved.
部门归属	[tian, feifei ; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
关键词	48sn52in Imc Morphology Orientation Relationship Ebsd Interfacial Reactions Soldering Reaction Joint Reliability Void Formation Solid-state Sn Cu3sn Alloy Creep
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72497
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	F. F. Tian,Z. Q. Liu. Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,588:662-667.
APA	F. F. Tian,&Z. Q. Liu.(2014).Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate.Journal of Alloys and Compounds,588,662-667.
MLA	F. F. Tian,et al."Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate".Journal of Alloys and Compounds 588(2014):662-667.