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题名: Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites
作者: Y. Kan;  Z. G. Liu;  S. H. Zhang;  L. W. Zhang;  M. Cheng;  H. W. Song
发表日期: 2014
刊名: Journal of Materials Engineering and Performance
相关网址: <Go to ISI>://WOS:000331659700045
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
Y. Kan,Z. G. Liu,S. H. Zhang,et al. Microstructure-based Numerical Simulation Of The Tensile Behavior Of Sicp/al Composites[J]. Journal Of Materials Engineering And Performance,2014,23(3):1069-1076.

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