IMR OpenIR
Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging
Z. Q. Liu; P. J. Shang; F. F. Tan; D. X. Li
2013
Source PublicationMicroscopy and Microanalysis
ISSN1431-9276
Volume19Pages:105-108
AbstractKirkendall void formation at the solder/metallization interface is an important reliability concern for Cu conductors and under-bump metallization in microelectronic packaging industry, whose mechanism is still hard to be understood for different individual cases. In the present work, two typical solder/Cu-diffusing couples, eutectic SnIn/Cu and SnBi/Cu, were studied by scanning/transmission electron microscopy to investigate the microstructural evolution and voiding process after soldering and then solid-state aging. It was concluded that Kirkendall voids formed between two sublayers within Cu-2(In, Sn) phase in eutectic SnIn/Cu solder joint, whereas they appeared at the Cu3Sn/Cu interface or within Cu3Sn for eutectic SnBi/Cu solder joint. Besides the effect of impurity elements, the morphological difference within one intermetallic compound layer could change the diffusing rates of reactive species, hence resulting in void formation in the reaction zone.
description.department[liu, zhi-quan ; shang, pan-ju ; tan, feifei ; li, douxing] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, liaoning, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, liaoning, peoples r china. ; zqliu@imr.ac.cn
KeywordLead-free Solder Kirkendall Void Intermetallic Compound (Imc) Diffusion Interface Transmission Electron Microscopy (Tem) Cu
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/72559
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Z. Q. Liu,P. J. Shang,F. F. Tan,et al. Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging[J]. Microscopy and Microanalysis,2013,19:105-108.
APA Z. Q. Liu,P. J. Shang,F. F. Tan,&D. X. Li.(2013).Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging.Microscopy and Microanalysis,19,105-108.
MLA Z. Q. Liu,et al."Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging".Microscopy and Microanalysis 19(2013):105-108.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Z. Q. Liu]'s Articles
[P. J. Shang]'s Articles
[F. F. Tan]'s Articles
Baidu academic
Similar articles in Baidu academic
[Z. Q. Liu]'s Articles
[P. J. Shang]'s Articles
[F. F. Tan]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Z. Q. Liu]'s Articles
[P. J. Shang]'s Articles
[F. F. Tan]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.