Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate

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	Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate
	F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo
	2014
发表期刊	Journal of Alloys and Compounds
ISSN	0925-8388
卷号	591 页码:351-355
摘要	The intermetallic compound (IMC) formed between eutectic SnIn solder and single crystalline Cu substrate during reflow and solid-state aging was investigated precisely utilizing electron microscope. Two kinds of crystal structures with different morphologies were identified, which are Cu(In, Sn)(2) at the solder side and the Cu-2(In, Sn) at the Cu substrate side. The Cu(In, Sn)(2) layer with chunk-type morphology suffered spalling easily during slightly increased liquid soldering at 160 degrees C, and Cu-2(In, Sn) was in the form of duplex structure with coarse-grain and fine-grain sublayers. During solid-state aging at 60 degrees C, the morphology of fine-grain Cu-2(In, Sn) kept granule-type, while that of the coarse-grain Cu-2(In, Sn) was substrate-dependent with elongated morphology. (C) 2014 Elsevier B.V. All rights reserved.
部门归属	[tian, feifei ; liu, zhi-quan ; shang, pan-ju ; guo, jingdong] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
关键词	Phase Identification Interface Imc Eutectic Snin Solder Single Crystalline Cu Gamma-angular Correlations Lead-free Solders Joint Reliability Growth-kinetics System Equilibria Mechanisms Interfaces Diffusion Layer
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72580
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	F. F. Tian,Z. Q. Liu,P. J. Shang,et al. Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,591:351-355.
APA	F. F. Tian,Z. Q. Liu,P. J. Shang,&J. D. Guo.(2014).Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate.Journal of Alloys and Compounds,591,351-355.
MLA	F. F. Tian,et al."Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate".Journal of Alloys and Compounds 591(2014):351-355.