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题名: Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
作者: M. N. Wang;  J. Q. Wang;  W. Ke
发表日期: 2014
刊名: Journal of Materials Science-Materials in Electronics
相关网址: <Go to ISI>://WOS:000331743200014
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
M. N. Wang,J. Q. Wang,W. Ke. Corrosion Behavior Of Sn-3.0ag-0.5cu Solder Under High-temperature And High-humidity Condition[J]. Journal Of Materials Science-materials In Electronics,2014,25(3):1228-1236.

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