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Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
M. N. Wang; J. Q. Wang; W. Ke
2014
Source PublicationJournal of Materials Science-Materials in Electronics
ISSN0957-4522
Volume25Issue:3Pages:1228-1236
AbstractThe aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The corrosion of SAC305 alloy was attributed to the oxidation of Sn, which formed SnO2 and SnO, and SnO2 existed on the outer layer of the oxide film. After a period exposure, a stable and dense protective oxide film formed on the specimen surfaces, and the specimen which exposed at 75 A degrees C had the thickset oxide film.
description.department[wang, mingna] hebei normal univ sci & technol, dept phys, qinhuangdao 066004, peoples r china. [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. ; wang, mn (reprint author), hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china. ; mnwang@alum.imr.ac.cn
KeywordLead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn
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Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/72585
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
M. N. Wang,J. Q. Wang,W. Ke. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Journal of Materials Science-Materials in Electronics,2014,25(3):1228-1236.
APA M. N. Wang,J. Q. Wang,&W. Ke.(2014).Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Journal of Materials Science-Materials in Electronics,25(3),1228-1236.
MLA M. N. Wang,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Journal of Materials Science-Materials in Electronics 25.3(2014):1228-1236.
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