Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

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	Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
	M. N. Wang; J. Q. Wang; W. Ke
	2014
发表期刊	Journal of Materials Science-Materials in Electronics
ISSN	0957-4522
卷号	25 期号:3 页码:1228-1236
摘要	The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The corrosion of SAC305 alloy was attributed to the oxidation of Sn, which formed SnO2 and SnO, and SnO2 existed on the outer layer of the oxide film. After a period exposure, a stable and dense protective oxide film formed on the specimen surfaces, and the specimen which exposed at 75 A degrees C had the thickset oxide film.
部门归属	[wang, mingna] hebei normal univ sci & technol, dept phys, qinhuangdao 066004, peoples r china. [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. ; wang, mn (reprint author), hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china. ; mnwang@alum.imr.ac.cn
关键词	Lead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72585
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,W. Ke. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Journal of Materials Science-Materials in Electronics,2014,25(3):1228-1236.
APA	M. N. Wang,J. Q. Wang,&W. Ke.(2014).Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Journal of Materials Science-Materials in Electronics,25(3),1228-1236.
MLA	M. N. Wang,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Journal of Materials Science-Materials in Electronics 25.3(2014):1228-1236.