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Tension-induced softening and hardening in gradient nanograined surface layer in copper
T. H. Fang; N. R. Tao; K. Lu
2014
Source PublicationScripta Materialia
ISSN1359-6462
Volume77Pages:17-20
AbstractWith surface mechanical grinding treatment, a gradient nanograined (GNG) surface layer is produced on a bulk coarse-grained (CG) pure Cu, where the grain size increases gradually from 20 nm (topmost surface) to micrometer scale. Microhardness measurements of the GNG/CG sample after tension revealed that tension induces softening for grains smaller than 165 nm and induces hardening above this size. This critical size agrees with the strain-induced saturation grain size of Cu subjected to severe plastic deformation. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
description.department[fang, t. h. ; tao, n. r. ; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [lu, k.] nanjing univ sci & technol, herbert gleiter inst nanosci, nanjing 210094, jiangsu, peoples r china. ; lu, k (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; lu@imr.ac.cn
KeywordHardness Test Grain Growth Grain Refinement Gradient Nanograined (Gng) Structure Copper Severe Plastic-deformation Microstructural Evolution Cryogenic Temperature Thermal-stability Room-temperature Grained Copper Nanocrystalline Nickel Cu Refinement
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Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/72842
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
T. H. Fang,N. R. Tao,K. Lu. Tension-induced softening and hardening in gradient nanograined surface layer in copper[J]. Scripta Materialia,2014,77:17-20.
APA T. H. Fang,N. R. Tao,&K. Lu.(2014).Tension-induced softening and hardening in gradient nanograined surface layer in copper.Scripta Materialia,77,17-20.
MLA T. H. Fang,et al."Tension-induced softening and hardening in gradient nanograined surface layer in copper".Scripta Materialia 77(2014):17-20.
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