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题名: Adhesion enhancement of diamond coating on minor Al-modified copper substrate
作者: X. J. Li;  Y. S. Li;  T. J. Pan;  L. Z. Yang;  L. L. He;  Q. Yang;  A. Hirose
发表日期: 2014
刊名: Diamond and Related Materials
相关网址: <Go to ISI>://WOS:000336697800001
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
X. J. Li,Y. S. Li,T. J. Pan,et al. Adhesion Enhancement Of Diamond Coating On Minor Al-modified Copper Substrate[J]. Diamond And Related Materials,2014,45:1-6.

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