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Adhesion enhancement of diamond coating on minor Al-modified copper substrate
X. J. Li; Y. S. Li; T. J. Pan; L. Z. Yang; L. L. He; Q. Yang; A. Hirose
2014
Source PublicationDiamond and Related Materials
ISSN0925-9635
Volume45Pages:1-6
AbstractWe report on the enhanced interfacial adhesion of diamond coating on copper substrate modified by a small fraction of Al. For pure copper substrate, the diamond coating formed tends to crack and delaminate, primarily caused by a slight accumulation of detrimental graphite intermediate layer and thermal stress induced by mismatch of the coefficients of thermal expansion. Additions of 1 and 3 at.% Al to the copper substrate gradually decrease the intermediate graphitic phase. At the higher Al concentration, an aluminium oxide forms at the coating-substrate interface, and graphitic/amorphous carbon is completely inhibited, leading to significantly enhanced interfacial adhesion of diamond coating. The electron structure of copper is not observed to significantly alter on this Cu-Al dilute alloy. The alumina barrier layer preferentially formed on copper surface is believed to play a key role in preventing graphitization and adhesion enhancement. (C) 2014 Elsevier B.V. All rights reserved.
description.department[li, x. j. ; he, l. l.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [li, y. s. ; yang, l. z. ; yang, q.] univ saskatchewan, dept mech engn, saskatoon, sk s7n 5a9, canada. [pan, t. j.] changzhou univ, dept mat sci & engn, changzhou 213164, peoples r china. [hirose, a.] univ saskatchewan, plasma phys lab, saskatoon, sk s7n 5e2, canada. ; li, ys (reprint author), univ saskatchewan, dept mech engn, saskatoon, sk s7n 5a9, canada. ; yuanshi_li@yahoo.com
KeywordDiamond Copper Cvd Adhesion Alloying Modification Cvd Diamond Films Growth Graphene Alloys Cu
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/72875
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
X. J. Li,Y. S. Li,T. J. Pan,et al. Adhesion enhancement of diamond coating on minor Al-modified copper substrate[J]. Diamond and Related Materials,2014,45:1-6.
APA X. J. Li.,Y. S. Li.,T. J. Pan.,L. Z. Yang.,L. L. He.,...&A. Hirose.(2014).Adhesion enhancement of diamond coating on minor Al-modified copper substrate.Diamond and Related Materials,45,1-6.
MLA X. J. Li,et al."Adhesion enhancement of diamond coating on minor Al-modified copper substrate".Diamond and Related Materials 45(2014):1-6.
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