IMR OpenIR
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint
F. F. Tian; P. J. Shang; Z. Q. Liu
2014
Source PublicationMaterials Letters
ISSN0167-577X
Volume121Pages:185-187
AbstractTo clarify the interfacial reactions in a liquid-solid system like solder joint, the location of reactive interface is very critical for mechanism investigation, which is hard to be determined due to its reactivity. Electroplated Cr-marker experiments were firstly applied to study the intermetallic compounds growth and Kirkendall voids formation in the solder joint between eutectic Snln and polycrystalline Cu. The original interface between Cu and liquid Snln solder was revealed being the reactive interface within the duplex structural Cu2(In,Sn) compounds, where the fine-grain sublayer grew into substrate side while the coarse-grain sublayer grew into solder side. This interface was also determined as the Kirkendall void plane between the coarse- and fine-grain Cu-2(In,Sn) sublayers, which is different from those between Cu substrate and intermetallic compound layer in other solder joints. This Kirkendall void plane remained stable during solid-state aging with increased void size, which could degrade the mechanical and electrical properties of the solder joint. (C) 2014 Elsevier B.V. All rights reserved.
description.department[tian, feifei ; shang, pan-ju ; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
KeywordInterfaces Intermetallic Alloys And Compounds Diffusion Kirkendall Void Snin Solder Cu Substrate Growth-kinetics Snagcu Solder Diffusion Compound Identification Ni
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/72913
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
F. F. Tian,P. J. Shang,Z. Q. Liu. Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint[J]. Materials Letters,2014,121:185-187.
APA F. F. Tian,P. J. Shang,&Z. Q. Liu.(2014).Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint.Materials Letters,121,185-187.
MLA F. F. Tian,et al."Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint".Materials Letters 121(2014):185-187.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[F. F. Tian]'s Articles
[P. J. Shang]'s Articles
[Z. Q. Liu]'s Articles
Baidu academic
Similar articles in Baidu academic
[F. F. Tian]'s Articles
[P. J. Shang]'s Articles
[Z. Q. Liu]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[F. F. Tian]'s Articles
[P. J. Shang]'s Articles
[Z. Q. Liu]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.