|Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder|
|X. J. Wang; Q. S. Zhu; B. Liu; N. Liu; F. J. Wang
|Source Publication||Journal of Materials Science-Materials in Electronics
|Abstract||The liquid oxidation behaviors of Sn-40Bi-2Zn and Sn-40Bi-2Zn-0.005Al solders were investigated from thermal dynamics and kinetics analysis. The characteristics of surface oxidation film at 170 A degrees C were studied by thermo gravimetric analysis and X-ray photoelectron spectroscopy (XPS). Sn-40Bi-2Zn solder performed inferiorly in oxidation prevention performance, due to the formation of ZnO, which exhibits lower Gibbs free energy of formation and higher growth rate. Trace amount of Al addition, however, alleviated the oxidation behavior of Zn. XPS depth profile results indicated that the surface layer of Sn-40Bi-2Zn-0.005Al consisted of oxides of Al and Zn formed on the outer surface of the solder film and in the subsequent layer, mainly formed by the oxides of Sn, Bi. Al, basically formed as Al2O3, segregated towards the outer surface, seemed to deter the Zn oxidation on the solder surface.|
|description.department||[wang, x. j.
; liu, b.
; liu, n.
; wang, f. j.] jiangsu univ sci & technol, sch mat & sci engn, zhenjiang 212003, peoples r china. [zhu, q. s.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.
; wang, xj (reprint author), jiangsu univ sci & technol, sch mat & sci engn, zhenjiang 212003, peoples r china.
Intermetallic Compound Growth
X. J. Wang,Q. S. Zhu,B. Liu,et al. Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder[J]. Journal of Materials Science-Materials in Electronics,2014,25(5):2297-2304.
X. J. Wang,Q. S. Zhu,B. Liu,N. Liu,&F. J. Wang.(2014).Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder.Journal of Materials Science-Materials in Electronics,25(5),2297-2304.
X. J. Wang,et al."Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder".Journal of Materials Science-Materials in Electronics 25.5(2014):2297-2304.
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