Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials

IMR OpenIR

	Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials
	E. Yang; H. Y. Guo; J. D. Guo; J. K. Shang; M. G. Wang
	2014
发表期刊	Acta Metallurgica Sinica-English Letters
ISSN	1006-7191
卷号	27 期号:2 页码:290-294
摘要	Thermal resistance of low-melting-temperature alloy (LMTA) thermal interface materials (TIMs) was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound (MC) at the solid liquid interface, a thick brittle WIC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.
部门归属	[yang, e. ; guo, hongyan ; guo, jingdong ; shang, jianku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [yang, e. ; wang, mingguang] northeastern univ, coll sci, shenyang 110189, peoples r china. [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; guo, jd (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; jdguo@imr.ac.cn
关键词	Thermal Interface Materials Low Melting Point Alloy Thermal Resistance
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72950
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	E. Yang,H. Y. Guo,J. D. Guo,et al. Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials[J]. Acta Metallurgica Sinica-English Letters,2014,27(2):290-294.
APA	E. Yang,H. Y. Guo,J. D. Guo,J. K. Shang,&M. G. Wang.(2014).Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials.Acta Metallurgica Sinica-English Letters,27(2),290-294.
MLA	E. Yang,et al."Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials".Acta Metallurgica Sinica-English Letters 27.2(2014):290-294.