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Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
M. N. Wang; J. Q. Wang; W. Ke
2014
Source PublicationJournal of Materials Science-Materials in Electronics
ISSN0957-4522
Volume25Issue:12Pages:5269-5276
AbstractIn this paper, the effects of microstructure on the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder were investigated by potentiodynamic polarization and atmospheric corrosion test. Scanning electron microscopy and X-ray diffraction were used to characterize the samples after the electrochemical and atmospheric corrosion tests. Results showed that commercial SAC305 solder exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders both in 3.5 wt% NaCl solution and at 60 A degrees C/100 % relative humidity condition.
description.department[wang, mingna] hebei normal univ sci & technol, dept phys, qinhuangdao 066004, peoples r china. [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. ; wang, mn (reprint author), hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china. ; mnwang@alum.imr.ac.cn
Keyword3.5-percent Nacl Solution Electrochemical Corrosion Polarization Characteristics Alloys Surface Joints
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/73417
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
M. N. Wang,J. Q. Wang,W. Ke. Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder[J]. Journal of Materials Science-Materials in Electronics,2014,25(12):5269-5276.
APA M. N. Wang,J. Q. Wang,&W. Ke.(2014).Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.Journal of Materials Science-Materials in Electronics,25(12),5269-5276.
MLA M. N. Wang,et al."Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder".Journal of Materials Science-Materials in Electronics 25.12(2014):5269-5276.
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