Advanced   Register
IMR OpenIR  > 中国科学院金属研究所  > 期刊论文

题名: Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
作者: M. N. Wang;  J. Q. Wang;  W. Ke
发表日期: 2014
刊名: Journal of Materials Science-Materials in Electronics
相关网址: <Go to ISI>://WOS:000344809500013
Appears in Collections:中国科学院金属研究所_期刊论文

Files in This Item:

There are no files associated with this item.

Recommended Citation:
M. N. Wang,J. Q. Wang,W. Ke. Effect Of Microstructure And Ag3sn Intermetallic Compounds On Corrosion Behavior Of Sn-3.0ag-0.5cu Lead-free Solder[J]. Journal Of Materials Science-materials In Electronics,2014,25(12):5269-5276.

SCI Citaion Data:
 Recommend this item
 Sava as my favorate item
 Show this item's statistics
 Export Endnote File
Google Scholar
 Similar articles in Google Scholar
 [M. N. Wang]'s Articles
 [J. Q. Wang]'s Articles
 [W. Ke]'s Articles
CSDL cross search
 Similar articles in CSDL Cross Search
 [M. N. Wang]‘s Articles
 [J. Q. Wang]‘s Articles
 [W. Ke]‘s Articles
Scirus search
 Similar articles in Scirus
Related Copyright Policies
Social Bookmarking
  Add to CiteULike  Add to Connotea  Add to  Add to Digg  Add to Reddit 
所有评论 (0)
内 容:
Email:  *
验证码:   刷新
标 题:
内 容:
Email:  *
验证码:   刷新

Items in IR are protected by copyright, with all rights reserved, unless otherwise indicated.



Valid XHTML 1.0!
Copyright © 2007-2018  中国科学院金属研究所  -Feedback
Powered by CSpace