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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints
H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai
2014
Source PublicationJournal of Materials Science & Technology
ISSN1005-0302
Volume30Issue:9Pages:928-933
AbstractFe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, and temperature cycling. The shear strengths for Fe-75Ni, Fe-50Ni, and Fe-30Ni solder joints after reflow were 42.57, 53.94 and 53.98 MPa, respectively, which were all satisfied the requirement of industrialization (>34.3 MPa). High temperature storage was conducted at 150, 175 and 200 degrees C. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region below 150 degrees C, and the growth speed of intermetallic compound (IMC) decreased with increasing Fe concentration. When stored at 200 degrees C, the IMC thickness reached a limit for all three films after 4 days, and some cracks occurred at the interface between IMC and Fe-Ni layer. The activation energies for the growth of FeSn2 on Fe-30Ni, Fe-50Ni, and Fe-75Ni films were calculated as 246, 185, and 81 kJ/mol, respectively. Temperature cycling tests revealed that SnAgCu/Fe-50Ni solder joint had the lowest failure rate (less than 10%), and had the best interfacial reliability among three compositions.
description.department[zhang, hao ; zhu, qing-sheng ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, peoples r china. [zhang, li ; guo, hongyan ; lai, chi-ming] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
KeywordFe-ni Alloy Under Bump Metallization (Ubm) Intermetallic Compound (Imc) Reliability High Temperature Storage Temperature Cycling Lead-free Solders Intermetallic Compounds Growth-kinetics Cu Metallization Ag Strength Ball Ubm
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/73491
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
H. Zhang,Q. S. Zhu,Z. Q. Liu,et al. Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints[J]. Journal of Materials Science & Technology,2014,30(9):928-933.
APA H. Zhang,Q. S. Zhu,Z. Q. Liu,L. Zhang,H. Y. Guo,&C. M. Lai.(2014).Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints.Journal of Materials Science & Technology,30(9),928-933.
MLA H. Zhang,et al."Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints".Journal of Materials Science & Technology 30.9(2014):928-933.
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