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题名: Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints
作者: H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
发表日期: 2014
刊名: Journal of Materials Science & Technology
相关网址: <Go to ISI>://WOS:000342800100014
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
H. Zhang,Q. S. Zhu,Z. Q. Liu,et al. Effect Of Fe Content On The Interfacial Reliability Of Snagcu/fe-ni Solder Joints[J]. Journal Of Materials Science & Technology,2014,30(9):928-933.

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