Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys

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	Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys
	R.; Zhang Liu, Z. J.; Li, L. L.; An, X. H.; Zhang, Z. F.
	2015
发表期刊	Scientific Reports
ISSN	2045-2322
卷号	5
摘要	In this study, the concept of "twinning induced plasticity (TWIP) alloys'' is broadened, and the underlying intrinsic microscopic mechanisms of the general TWIP effect are intensively explored. For the first aspect, "TWIP copper alloys'' was proposed following the concept of "TWIP steels'', as they share essentially the same strengthening and toughening mechanisms. For the second aspect, three intrinsic features of twinning: i.e. "dynamic development'', "planarity'', as well as "orientation selectivity'' were derived from the detailed exploration of the deformation behavior in TWIP copper alloys. These features can be considered the microscopic essences of the general "TWIP effect''. Moreover, the effective cooperation between deformation twinning and dislocation slipping in TWIP copper alloys leads to a desirable tendency: the synchronous improvement of strength and plasticity (SISP). This breakthrough against the traditional trade-off relationship, achieved by the general "TWIP effect'', may provide useful strategies for designing high-performance engineering materials.
部门归属	[liu, r. ; zhang, z. j. ; li, l. l. ; an, x. h. ; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zhfzhang@imr.ac.cn
关键词	Centered-cubic Metals Stacking-fault Energy High-pressure Torsion Cu-zn Alloys Microstructural Evolution Grain-size Deformation Boundaries Steel Dislocations
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/73866
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	R.,Zhang Liu, Z. J.,Li, L. L.,et al. Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys[J]. Scientific Reports,2015,5.
APA	R.,Zhang Liu, Z. J.,Li, L. L.,An, X. H.,&Zhang, Z. F..(2015).Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys.Scientific Reports,5.
MLA	R.,et al."Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys".Scientific Reports 5(2015).