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Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
K.; Kong Wang, L. Y.; Tao, Y. S.; Li, T. F.; Xiong, T. Y.
2015
Source PublicationJournal of Thermal Spray Technology
ISSN1059-9630
Volume24Issue:42006Pages:75-85
AbstractIn this work, finite element simulations were performed to investigate the competition between bonding and rebounding when a Cu particle of 25 mu m in diameter impinged Cu substrate. With the help of cohesive zone model, the trend of the minimal average bonding strength to suppress rebounding (MABSSR) was predicted as a function of initial velocity under certain conditions. Result shows, MABSSR has a nonlinear trend versus initial velocity under the conditions considered. If the real trend of MABSSR is similar to that observed, a hypothesis is presented to explain the critical deposition velocity. Finally, defects in the current work are discussed. Analysis shows the defects have no influence on predicting the overall trend of MABSSR in the current work.
description.department[wang, kai ; kong, lingyan ; tao, yongshan ; li, tiefan ; xiong, tianying] chinese acad sci, inst met res, shenyang 110016, peoples r china. ; wang, k (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china. ; tyxiong@imr.ac.cn
KeywordAdhesion Energy Bonding Mechanism Bonding Strength Cold Spraying Contact Area Finite Element Method (Fem) Rebounding Energy Powder Particles Copper Coatings Deposition Deformation Mechanism Friction Solids Metal
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/73953
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
K.,Kong Wang, L. Y.,Tao, Y. S.,et al. Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study[J]. Journal of Thermal Spray Technology,2015,24(42006):75-85.
APA K.,Kong Wang, L. Y.,Tao, Y. S.,Li, T. F.,&Xiong, T. Y..(2015).Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study.Journal of Thermal Spray Technology,24(42006),75-85.
MLA K.,et al."Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study".Journal of Thermal Spray Technology 24.42006(2015):75-85.
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