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题名: Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
作者: K.;  Kong Wang, L. Y.;  Tao, Y. S.;  Li, T. F.;  Xiong, T. Y.
发表日期: 2015
刊名: Journal of Thermal Spray Technology
相关网址: <Go to ISI>://WOS:000347416800010
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
K.,Kong Wang, L. Y.,Tao, Y. S.,et al. Numerical Simulation Of Minimal Average Bonding Strength To Suppress Rebounding In Cold Spraying Cu/cu: A Preliminary Study[J]. Journal Of Thermal Spray Technology,2015,24(42006):75-85.

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