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Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint
L. M.; Zhang Yang, Z. F.
2015
Source PublicationJournal of Applied Physics
ISSN0021-8979
Volume117Issue:1
AbstractA sort of composite solder was produced by adding Y2O3 nanoparticles in Sn3.0Ag0.5Cu solder. The microstructure and tensile strength of solder joint were investigated. It was found that the size of intermetallic compounds and tensile strength of solder joint were notably influenced by the nanoparticles. The growth behaviors of intermetallic compounds Ag3Sn and Cu6Sn5 were suppressed due to the addition of Y2O3 nanoparticles. The tensile test results revealed that the strength of composite solder joint was higher than that of solder joint without nanoparticles addition. It is indicated that Y2O3 nanoparticles should play important roles in strengthening of joint by hampering dislocation movement. (C) 2015 AIP Publishing LLC.
description.department[yang, l. m. ; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [yang, l. m.] shenyang univ technol, dept appl phys, shenyang 110870, peoples r china. ; zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china. ; zhfzhang@imr.ac.cn
KeywordAg-cu Solder Growth Behaviors Packages Lead
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/74001
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
L. M.,Zhang Yang, Z. F.. Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint[J]. Journal of Applied Physics,2015,117(1).
APA L. M.,&Zhang Yang, Z. F..(2015).Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint.Journal of Applied Physics,117(1).
MLA L. M.,et al."Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint".Journal of Applied Physics 117.1(2015).
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