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题名: Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
作者: L. M.;  Zhang Yang, Z. F.
发表日期: 2015
刊名: Journal of Electronic Materials
相关网址: <Go to ISI>://WOS:000346703800076
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
L. M.,Zhang Yang, Z. F. Growth Behavior Of Intermetallic Compounds In Cu/sn3.0ag0.5cu Solder Joints With Different Rates Of Cooling[J]. Journal Of Electronic Materials,2015,44(1):590-596.

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