Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate | |
B.; Xiao Zhang, T. Y.; Luo, X. M.; Zhu, X. F.; Zhang, G. P. | |
2015 | |
发表期刊 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
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ISSN | 0921-5093 |
卷号 | 627页码:61-64 |
摘要 | We clearly show that fatigue-induced grain growth is suppressed in the annealed nanocrystalline Cu films, which leads to the enhanced resistance to fatigue cracking compared with that of the as-deposited ones. Annealing-stabilization of the nanograin boundaries may provide a potential way to enhance fatigue reliability of nanoscale film-based flexible devices. (C) 2015 Elsevier B.V. All rights reserved. |
部门归属 | [zhang, b. ; xiao, t. y.] northeastern univ, key lab anisotropy & texture mat, minist educ, shenyang 110819, peoples r china. [xiao, t. y. ; luo, x. m. ; zhu, x. f. ; zhang, g. p.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zhang, b (reprint author), northeastern univ, key lab anisotropy & texture mat, minist educ, 3-11 wenhua rd, shenyang 110819, peoples r china. ; zhangb@atm.neu.edu.cn |
关键词 | Fatigue Thin Film Nanocrystalline Grain Growth Copper Metals |
URL | 查看原文 |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/74013 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | B.,Xiao Zhang, T. Y.,Luo, X. M.,et al. Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2015,627:61-64. |
APA | B.,Xiao Zhang, T. Y.,Luo, X. M.,Zhu, X. F.,&Zhang, G. P..(2015).Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,627,61-64. |
MLA | B.,et al."Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 627(2015):61-64. |
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