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GH4698合金的疲劳裂纹扩展行为
王欢; 袁超; 郭建亭; 秦鹤勇
2015-01-15
Source Publication中国有色金属学报
Issue1Pages:23-29
Abstract对GH4698合金在室温、650及750℃的裂纹扩展行为进行研究,讨论温度对裂纹扩展寿命与速率的影响,观察不同温度下的裂纹扩展断口。采用背散射电子衍射(EBSD)技术对合金裂纹扩展的晶体学机制进行分析。结果表明,随着温度的升高,合金的裂纹扩展寿命降低,裂纹扩展速率增加,断裂模式由室温下穿晶断裂为主转变为高温下的沿晶断裂为主;裂纹附近应变程度较大,且小角度晶界密度较高。
description.department中国科学院金属研究所 ; 钢铁研究总院高温材料研究所
Keyword镍基高温合金 疲劳裂纹扩展 疲劳机制
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/74082
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
王欢,袁超,郭建亭,等. GH4698合金的疲劳裂纹扩展行为[J]. 中国有色金属学报,2015(1):23-29.
APA 王欢,袁超,郭建亭,&秦鹤勇.(2015).GH4698合金的疲劳裂纹扩展行为.中国有色金属学报(1),23-29.
MLA 王欢,et al."GH4698合金的疲劳裂纹扩展行为".中国有色金属学报 .1(2015):23-29.
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