Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging

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IMR OpenIR > 中国科学院金属研究所 > 期刊论文

题名:	Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging
作者:	Zhang, Q. K.; Long, W. M.; Zhang, Z. F.
发表日期:	2015
刊名:	JOURNAL OF ALLOYS AND COMPOUNDS
Appears in Collections:	中国科学院金属研究所_期刊论文

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Recommended Citation:

Zhang, Q. K.,Long, W. M.,Zhang, Z. F. Growth Behavior Of Intermetallic Compounds At Sn-ag/cu Joint Interfaces Revealed By 3d Imaging[J]. Journal Of Alloys And Compounds,2015,646:405-411.

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