Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging

IMR OpenIR

	Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging
	Zhang, Q. K.; Long, W. M.; Zhang, Z. F.; qkzhang@alum.imr.ac.cn; zhfzhang@imr.ac.cn
	2015
发表期刊	JOURNAL OF ALLOYS AND COMPOUNDS
ISSN	0925-8388
卷号	646 页码:405-411
摘要	In this study, the morphologies of intermetallic compounds (IMCs) at the as-soldered and thermal aged SneAg/Cu joint interfaces were observed by SEM and measured using Laser Confocal Microscope, and their three-dimensional (3D) shapes were revealed using 3D imaging technology. The observation reveal that during the soldering process the Cu6Sn5 grains at the joint interface evolve from hemispheroid to a bamboo shoot-shaped body with increasing liquid state reacting time, and their grain size increases sharply. After thermal aging, the Cu6Sn5 grains change into equiaxed grains, while the top of some prominent Cu6Sn5 grains changes little. Due to the higher active energy of the Sn atoms at the grain boundary, the growth rate of IMC grains around the grain boundaries of the solder is higher during the aging process. From the evolution in morphology of the IMC layer, it is demonstrated that the IMC layer grows through grain boundary diffusion of the Cu and Sn atoms during the aging process, and the volume diffusion is very little. The 3D imaging technology is used to reveal the shape and dimension of the IMC grains. (C) 2015 Elsevier B.V. All rights reserved.
部门归属	[zhang, q. k. ; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [zhang, q. k. ; long, w. m.] zhengzhou res inst mech engn, state key lab adv brazing filler met & technol, zhengzhou 450001, peoples r china
关键词	Lead-free Solder Intermetallic Compounds 3d Imaging Thermal Aging Grain Boundary
资助者	International S&T Cooperation Program of China (ISTCP) [2014DFR50820]; National Basic Research Program of China [2010CB631006]
收录类别	sci
语种	英语
WOS记录号	WOS:000361153700061
引用统计	被引频次：13[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/74872
专题	中国科学院金属研究所
通讯作者	qkzhang@alum.imr.ac.cn; zhfzhang@imr.ac.cn
推荐引用方式 GB/T 7714	Zhang, Q. K.,Long, W. M.,Zhang, Z. F.,et al. Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015,646:405-411.
APA	Zhang, Q. K.,Long, W. M.,Zhang, Z. F.,qkzhang@alum.imr.ac.cn,&zhfzhang@imr.ac.cn.(2015).Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging.JOURNAL OF ALLOYS AND COMPOUNDS,646,405-411.
MLA	Zhang, Q. K.,et al."Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging".JOURNAL OF ALLOYS AND COMPOUNDS 646(2015):405-411.