Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces

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	Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces
	Zhang, Z. H.; Li, M. Y.; Liu, Z. Q.; Yang, S. H.; zhzhang@xmu.edu.cn; myli@hit.edu.cn
	2016
发表期刊	ACTA MATERIALIA
ISSN	1359-6454
卷号	104 页码:1-8
摘要	This work investigated the growth characteristics and formation mechanisms of the Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces. As a result of contributions from the interfacial environments, regular arrays of the roof-type Cu6Sn5 grains with fixed intersecting angles were generated on both types of the Cu single crystals after soldering at 250 degrees C for 1 s-1 h. At the liquid-Sn0.7Cu/Cu6Sn5 interface, a hexagonal-rod-type growth mechanism for Cu6Sn5 phase was proposed on the basis of its anisotropy in surface energy and roughness. According to this mechanism, the Cu6Sn5 roofs formed on the (111) and (001) Cu pads would consistently elongate in the [0001] direction of Cu6Sn5 phase, regardless of whether they belonged to the minimum mismatch direction of Cu6Sn5 and Cu phases; and they would maintain the {11 (2) over bar0} and {00 (1) over bar0} planes as the side faces respectively, despite the reaction time being prolonged to 1 h. At the Cu6Sn5/Cu interface, two types of the three-dimensional placement rules for Cu6Sn5 roofs on the Cu single crystals were determined on the basis of the suitable Cu matches of these two phases. Specifically, the junction interfaces between Cu6Sn5 roofs and. Cu single crystals were confirmed to be parallel to{10 (1) over bar0} parallel to {111} and {11 (2) over bar0} parallel to {001}; and the parallel orientation relationships of {0001} parallel to {011} were always present on both types of interfaces. Our study can help to clarify the growth mechanism of Cu6Sn5 phase and to provide a scientific basis of Cu6Sn5 orientation design for three-dimensional integrated circuit interconnect applications. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[zhang, z. h. ; li, m. y. ; liu, z. q.] harbin inst technol, state key lab adv welding & joining, shenzhen grad sch, shenzhen 518055, peoples r china ; [zhang, z. h.] xiamen univ, dept mat sci & engn, coll mat, xiamen 361005, peoples r china ; [liu, z. q.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [yang, s. h.] shanghai aerosp equipments manufacturer, shanghai 200245, peoples r china
关键词	Intermetallic Compounds Microstructure Formation Mechanism Cu Single Crystal Orientation Soldering
资助者	National Natural Science Foundation of China [51175116, 51305103]; China Postdoctoral Science Foundation [2013M530153]
收录类别	sci
语种	英语
WOS记录号	WOS:000369677800001
引用统计	被引频次：58[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/74873
专题	中国科学院金属研究所
通讯作者	zhzhang@xmu.edu.cn; myli@hit.edu.cn
推荐引用方式 GB/T 7714	Zhang, Z. H.,Li, M. Y.,Liu, Z. Q.,et al. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces[J]. ACTA MATERIALIA,2016,104:1-8.
APA	Zhang, Z. H.,Li, M. Y.,Liu, Z. Q.,Yang, S. H.,zhzhang@xmu.edu.cn,&myli@hit.edu.cn.(2016).Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces.ACTA MATERIALIA,104,1-8.
MLA	Zhang, Z. H.,et al."Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces".ACTA MATERIALIA 104(2016):1-8.