Improved Fatigue Strengths of Nanocrystalline Cu and Cu-Al Alloys | |
An, Xianghai; Lin, Qingyun; Wu, Shiding; Zhang, Zhefeng; anxianghai@gmail.com; zhfzhang@imr.ac.cn | |
2015 | |
发表期刊 | MATERIALS RESEARCH LETTERS
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ISSN | 2166-3831 |
卷号 | 3期号:3页码:135-141 |
摘要 | Increasing the fatigue strengths of high-strength materials, especially their endurance limits is essentially challenging. The fatigue strengths of nanocrystalline (NC) Cu and Cu-Al alloys processed by high-pressure torsion were prominently enhanced with a decrease in stacking fault energy. This remarkable escalation can be attributed not only to their significantly increased tensile strengths in macro-scale, but also to the essentially improved microstructure stability and reduced strain localization within shear bands in microscale. Owing to the limitation of their intrinsic fatigue mechanisms, the fatigue limits of NC Cu and Cu-Al alloys cannot always acquire appreciable improvement with their monotonic strengths. |
部门归属 | [an, xianghai ; lin, qingyun ; wu, shiding ; zhang, zhefeng] chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china |
关键词 | Nanocrystalline Stacking Fault Energy Fatigue Strength Fatigue Mechanism Severe Plastic Deformation |
资助者 | National Natural Science Foundation of China [50931005, 51101162, 51331007] |
收录类别 | sci |
语种 | 英语 |
WOS记录号 | WOS:000372219300003 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/74900 |
专题 | 中国科学院金属研究所 |
通讯作者 | anxianghai@gmail.com; zhfzhang@imr.ac.cn |
推荐引用方式 GB/T 7714 | An, Xianghai,Lin, Qingyun,Wu, Shiding,et al. Improved Fatigue Strengths of Nanocrystalline Cu and Cu-Al Alloys[J]. MATERIALS RESEARCH LETTERS,2015,3(3):135-141. |
APA | An, Xianghai,Lin, Qingyun,Wu, Shiding,Zhang, Zhefeng,anxianghai@gmail.com,&zhfzhang@imr.ac.cn.(2015).Improved Fatigue Strengths of Nanocrystalline Cu and Cu-Al Alloys.MATERIALS RESEARCH LETTERS,3(3),135-141. |
MLA | An, Xianghai,et al."Improved Fatigue Strengths of Nanocrystalline Cu and Cu-Al Alloys".MATERIALS RESEARCH LETTERS 3.3(2015):135-141. |
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