|Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine|
|Ren, Rong; Xiong, Xuhai; Ma, Xinghua; Liu, Siyang; Wang, Jing; Chen, Ping; Zeng, You; email@example.com
|Source Publication||THERMOCHIMICA ACTA
|Abstract||The curing reaction of diglycidyl ether of bisphenol A (DGEBA) with a novel aromatic diamine containing phthalide structure (BAPP) was studied by differential scanning calorimetery (DSC). The optimal formulation of DGEBA/BAPP system was obtained in terms of the curing behavior and glass transition temperature determined by dynamic DSC. The nth-order reaction model and autocatalytic model were used to analyze the curing kinetics and mechanism based on the isothermal DSC technique. The results indicated that the Kamal autocatalytic model had a great agreement with the experimental data from the start of curing reaction to the initiation of diffusion control stage. Diffusion-controlled effect was also taken into account and then the extended Kamal model could describe precisely the curing reaction of BAPP/DGEBA in the entire conversion range. (C) 2015 Elsevier B.V. All rights reserved.|
; xiong, xuhai
; ma, xinghua
; wang, jing] shenyang aerosp univ, liaoning key lab adv polymer matrix composites, 37 daoyi south ave, shenyang 110136, peoples r china
; [liu, siyang
; chen, ping] dalian univ technol, sch chem engn, state key lab fine chem, dalian 116012, peoples r china
; [xiong, xuhai
; zeng, you] chinese acad sci, inst met res, adv carbon div, shenyang natl lab mat sci, shenyang 110016, peoples r china
|Funding Organization||National Natural Science Foundation of China ; Liaoning Key Laboratory Fundamental Research Project [LZ2015058]; Aerospace Science Foundation of China [2014ZF54030]; National Defense 12th Five-Year Fundamental Research Program [A352010****]; Shenyang National Laboratory for Material Science [2015RP13]
Ren, Rong,Xiong, Xuhai,Ma, Xinghua,et al. Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine[J]. THERMOCHIMICA ACTA,2016,623:15-21.
Ren, Rong.,Xiong, Xuhai.,Ma, Xinghua.,Liu, Siyang.,Wang, Jing.,...&firstname.lastname@example.org.(2016).Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine.THERMOCHIMICA ACTA,623,15-21.
Ren, Rong,et al."Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine".THERMOCHIMICA ACTA 623(2016):15-21.
|Files in This Item:||
||There are no files associated with this item.
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.