IMR OpenIR
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
Ma, Huicai; Guo, Jingdong; Chen, Jianqiang; Wu, Di; Liu, Zhiquan; Zhu, Qingsheng; Shang, Jianku; Zhang, Li; Guo, Hongyan; jdguo@imr.ac.cn; jkshang@imr.ac.cn
2016
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume27Issue:2Pages:1184-1190
AbstractConsidering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, Delta Q(e) is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of -40 to 125 A degrees C and a superimposed electric current with current densities of 17.4-22.4 x 10(4) A/cm(2). The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.
description.department[ma, huicai ; guo, jingdong ; chen, jianqiang ; wu, di ; liu, zhiquan ; zhu, qingsheng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa ; [zhang, li ; guo, hongyan] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
Funding OrganizationNatural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602]; Natural Science Foundation of Liaoning Province [2013020015]
Indexed Bysci
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/75066
Collection中国科学院金属研究所
Corresponding Authorjdguo@imr.ac.cn; jkshang@imr.ac.cn
Recommended Citation
GB/T 7714
Ma, Huicai,Guo, Jingdong,Chen, Jianqiang,et al. Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(2):1184-1190.
APA Ma, Huicai.,Guo, Jingdong.,Chen, Jianqiang.,Wu, Di.,Liu, Zhiquan.,...&jkshang@imr.ac.cn.(2016).Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(2),1184-1190.
MLA Ma, Huicai,et al."Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.2(2016):1184-1190.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Ma, Huicai]'s Articles
[Guo, Jingdong]'s Articles
[Chen, Jianqiang]'s Articles
Baidu academic
Similar articles in Baidu academic
[Ma, Huicai]'s Articles
[Guo, Jingdong]'s Articles
[Chen, Jianqiang]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Ma, Huicai]'s Articles
[Guo, Jingdong]'s Articles
[Chen, Jianqiang]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.