|Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling|
|Ma, Huicai; Guo, Jingdong; Chen, Jianqiang; Wu, Di; Liu, Zhiquan; Zhu, Qingsheng; Shang, Jianku; Zhang, Li; Guo, Hongyan; firstname.lastname@example.org; email@example.com
|Source Publication||JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
|Abstract||Considering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, Delta Q(e) is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of -40 to 125 A degrees C and a superimposed electric current with current densities of 17.4-22.4 x 10(4) A/cm(2). The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.|
; guo, jingdong
; chen, jianqiang
; wu, di
; liu, zhiquan
; zhu, qingsheng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china
; [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa
; [zhang, li
; guo, hongyan] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
|Funding Organization||Natural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602]; Natural Science Foundation of Liaoning Province 
|Corresponding Authorfirstname.lastname@example.org; email@example.com|
Ma, Huicai,Guo, Jingdong,Chen, Jianqiang,et al. Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(2):1184-1190.
Ma, Huicai.,Guo, Jingdong.,Chen, Jianqiang.,Wu, Di.,Liu, Zhiquan.,...&firstname.lastname@example.org.(2016).Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(2),1184-1190.
Ma, Huicai,et al."Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.2(2016):1184-1190.
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