Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling

IMR OpenIR

	Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
	Ma, Huicai; Guo, Jingdong; Chen, Jianqiang; Wu, Di; Liu, Zhiquan; Zhu, Qingsheng; Shang, Jianku; Zhang, Li; Guo, Hongyan; jdguo@imr.ac.cn; jkshang@imr.ac.cn
	2016
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	27 期号:2 页码:1184-1190
摘要	Considering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, Delta Q(e) is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of -40 to 125 A degrees C and a superimposed electric current with current densities of 17.4-22.4 x 10(4) A/cm(2). The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.
部门归属	[ma, huicai ; guo, jingdong ; chen, jianqiang ; wu, di ; liu, zhiquan ; zhu, qingsheng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa ; [zhang, li ; guo, hongyan] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
资助者	Natural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602]; Natural Science Foundation of Liaoning Province [2013020015]
收录类别	sci
语种	英语
WOS记录号	WOS:000369010900019
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/75066
专题	中国科学院金属研究所
通讯作者	jdguo@imr.ac.cn; jkshang@imr.ac.cn
推荐引用方式 GB/T 7714	Ma, Huicai,Guo, Jingdong,Chen, Jianqiang,et al. Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(2):1184-1190.
APA	Ma, Huicai.,Guo, Jingdong.,Chen, Jianqiang.,Wu, Di.,Liu, Zhiquan.,...&jkshang@imr.ac.cn.(2016).Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(2),1184-1190.
MLA	Ma, Huicai,et al."Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.2(2016):1184-1190.