|The reliability of copper pillar under the coupling of thermal cycling and electric current stressing|
|Ma, HC; Guo, JD; Chen, JQ; Wu, D; Liu, ZQ; Zhu, QS; Zhang, L; Guo, HY; Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
|发表期刊||JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
|摘要||Cu pillar samples were subject to the thermal cycling test along with current stressing to investigate its reliability issues under the coupling effect. Analysis of scanning electron microscopy (SEM) pictures of Cu pillar bumps showed the evolution of interfacial microstructure. The finite element analysis pointed out the probable site of cracks initiation based on the strain and stress distribution. Three failure modes, electromigration (EM) induced cracks at Cu6Sn5/Sn interface on cathode, cracking of Cu/Cu3Sn interface on anode side, and fatigue-creep induced cracks in Sn solder, took place at the interfaces of copper pillar interconnect under electric current and thermal cycling. In addition, EM induced failure increased while fatigue-creep failure decreased with electric current density. The failure mechanisms were analyzed from stress concentration, interfacial morphology and voids formation respects.|
; guo, jing-dong
; chen, jian-qiang
; wu, di
; liu, zhi-quan
; zhu, qing-sheng] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china
; [zhang, li
; guo, hong-yan] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
|学科领域||Engineering, Electrical & Electronic
; Materials Science, Multidisciplinary
; Physics, Applied
; Physics, Condensed Matter
|资助者||Natural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602]
|通讯作者||Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.|
Ma, HC,Guo, JD,Chen, JQ,et al. The reliability of copper pillar under the coupling of thermal cycling and electric current stressing[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(9):9748-9754.
Ma, HC.,Guo, JD.,Chen, JQ.,Wu, D.,Liu, ZQ.,...&Guo, JD .(2016).The reliability of copper pillar under the coupling of thermal cycling and electric current stressing.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(9),9748-9754.
Ma, HC,et al."The reliability of copper pillar under the coupling of thermal cycling and electric current stressing".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.9(2016):9748-9754.