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Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu; Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
2017-08-01
Source PublicationJOURNAL OF ELECTRONIC MATERIALS
ISSN0361-5235
Volume46Issue:8Pages:5338-5348
AbstractThermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 mu m, 1.7 mu m, and 1.4 mu m thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.; Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 mu m, 1.7 mu m, and 1.4 mu m thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.
description.department[gao, li-yin ; liu, zhi-quan ; li, cai-fu] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [gao, li-yin ; liu, zhi-quan] univ chinese acad sci, beijing 100049, peoples r china
KeywordFe-ni Under Bump Metallization (Ubm) Thermal Cycling Microstructural Evolution Lifetime Recrystallization Electron Backscatter Diffraction (Ebsd)
Subject AreaEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied
Funding OrganizationMajor National Science and Technology Program of China [2011ZX02602]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78030
Collection中国科学院金属研究所
Corresponding AuthorLiu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
Recommended Citation
GB/T 7714
Gao, Li-Yin,Liu, Zhi-Quan,Li, Cai-Fu,et al. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling[J]. JOURNAL OF ELECTRONIC MATERIALS,2017,46(8):5338-5348.
APA Gao, Li-Yin,Liu, Zhi-Quan,Li, Cai-Fu,Liu, ZQ ,&Liu, ZQ .(2017).Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling.JOURNAL OF ELECTRONIC MATERIALS,46(8),5338-5348.
MLA Gao, Li-Yin,et al."Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling".JOURNAL OF ELECTRONIC MATERIALS 46.8(2017):5338-5348.
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