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Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance
Ping, Linquan; Hou, Peng-Xiang; Liu, Chang; Li, Jincheng; Zhao, Yang; Zhang, Feng; Ma, Chaoqun; Tai, Kaiping; Cong, Hongtao; Cheng, Hui-Ming; Hou, PX; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.
2017-06-28
发表期刊NANOSCALE
ISSN2040-3364
卷号9期号:24页码:8213-8219
摘要A vertically aligned carbon nanotube (VACNT) array is a promising candidate for a high-performance thermal interface material in high-power microprocessors due to its excellent thermal transport property. However, its rough and entangled free tips always cause poor interfacial contact, which results in serious contact resistance dominating the total thermal resistance. Here, we employed a thin carbon cover to restrain the disorderly growth of the free tips of a VACNT array. As a result, all the free tips are seamlessly connected by this thin carbon cover and the top surface of the array is smoothed. This unique structure guarantees the participation of all the carbon nanotubes in the array in the heat transport. Consequently the VACNT array grown on a Cu substrate shows a record low thermal resistance of 0.8 mm(2) K W-1 including the two-sided contact resistances, which is 4 times lower than the best result previously reported. Remarkably, the VACNT array can be easily peeled away from the Cu substrate and act as a thermal pad with excellent flexibility, adhesive ability and heat transport capability. As a result the CNT array with a thin carbon cover shows great potential for use as a high-performance flexible thermal interface material.; A vertically aligned carbon nanotube (VACNT) array is a promising candidate for a high-performance thermal interface material in high-power microprocessors due to its excellent thermal transport property. However, its rough and entangled free tips always cause poor interfacial contact, which results in serious contact resistance dominating the total thermal resistance. Here, we employed a thin carbon cover to restrain the disorderly growth of the free tips of a VACNT array. As a result, all the free tips are seamlessly connected by this thin carbon cover and the top surface of the array is smoothed. This unique structure guarantees the participation of all the carbon nanotubes in the array in the heat transport. Consequently the VACNT array grown on a Cu substrate shows a record low thermal resistance of 0.8 mm(2) K W-1 including the two-sided contact resistances, which is 4 times lower than the best result previously reported. Remarkably, the VACNT array can be easily peeled away from the Cu substrate and act as a thermal pad with excellent flexibility, adhesive ability and heat transport capability. As a result the CNT array with a thin carbon cover shows great potential for use as a high-performance flexible thermal interface material.
部门归属[ping, linquan ; hou, peng-xiang ; liu, chang ; li, jincheng ; zhao, yang ; zhang, feng ; ma, chaoqun ; tai, kaiping ; cong, hongtao ; cheng, hui-ming] chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china ; [ping, linquan ; zhao, yang] univ sci & technol china, sch mat sci & engn, hefei 230026, peoples r china ; [cheng, hui-ming] tsinghua univ, tsinghua berkeley shenzhen inst, shenzhen 518055, peoples r china
学科领域Chemistry, Multidisciplinary ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied
资助者Ministry of Science and Technology of China [2016YFA0200101]; National Natural Science Foundation of China [51625203, 51532008, 51521091, 51572264, 51372254]; Chinese Academy of Sciences [KGZD-EW-T06]; CAS/SAFEA International Partnership Program for Creative Research Teams; Liaoning BaiQianWan Talents Program
收录类别SCI
语种英语
WOS记录号WOS:000403943600020
引用统计
被引频次:13[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/78077
专题中国科学院金属研究所
通讯作者Hou, PX; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.
推荐引用方式
GB/T 7714
Ping, Linquan,Hou, Peng-Xiang,Liu, Chang,et al. Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance[J]. NANOSCALE,2017,9(24):8213-8219.
APA Ping, Linquan.,Hou, Peng-Xiang.,Liu, Chang.,Li, Jincheng.,Zhao, Yang.,...&Liu, C .(2017).Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance.NANOSCALE,9(24),8213-8219.
MLA Ping, Linquan,et al."Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance".NANOSCALE 9.24(2017):8213-8219.
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