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Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
Wang, Mingna; Wang, Jianqiu; Ke, Wei; Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
2017-06-01
Source PublicationMICROELECTRONICS RELIABILITY
ISSN0026-2714
Volume73Pages:69-75
AbstractThe aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.; The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.
description.department[wang, mingna] hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china ; [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china
KeywordLead-free Solder Joint Corrosion Microstructure Solidification Cracks
Subject AreaEngineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
Funding OrganizationNational Natural Science Foundation of China (NSFC) [51601057]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78103
Collection中国科学院金属研究所
Corresponding AuthorWang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
Recommended Citation
GB/T 7714
Wang, Mingna,Wang, Jianqiu,Ke, Wei,et al. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. MICROELECTRONICS RELIABILITY,2017,73:69-75.
APA Wang, Mingna,Wang, Jianqiu,Ke, Wei,&Wang, MN .(2017).Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints.MICROELECTRONICS RELIABILITY,73,69-75.
MLA Wang, Mingna,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints".MICROELECTRONICS RELIABILITY 73(2017):69-75.
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