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Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
Wang, Mingna; Wang, Jianqiu; Ke, Wei; Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
2017-06-01
发表期刊MICROELECTRONICS RELIABILITY
ISSN0026-2714
卷号73页码:69-75
摘要The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.; The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.
部门归属[wang, mingna] hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china ; [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china
关键词Lead-free Solder Joint Corrosion Microstructure Solidification Cracks
学科领域Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
资助者National Natural Science Foundation of China (NSFC) [51601057]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/78103
专题中国科学院金属研究所
通讯作者Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
推荐引用方式
GB/T 7714
Wang, Mingna,Wang, Jianqiu,Ke, Wei,et al. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. MICROELECTRONICS RELIABILITY,2017,73:69-75.
APA Wang, Mingna,Wang, Jianqiu,Ke, Wei,&Wang, MN .(2017).Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints.MICROELECTRONICS RELIABILITY,73,69-75.
MLA Wang, Mingna,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints".MICROELECTRONICS RELIABILITY 73(2017):69-75.
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