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Electromigration anisotropy introduced by tin orientation in solder joints
Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku; Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
2017-05-05
Source PublicationJOURNAL OF ALLOYS AND COMPOUNDS
ISSN0925-8388
Volume703Pages:264-271
AbstractSingle-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved.; Single-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved.
description.department[chen, jian-qiang ; liu, kai-lang ; guo, jing-dong ; ma, hui-cai ; wei, song] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [chen, jian-qiang] harbin inst technol, shenzhen grad sch, shenzhen 518055, peoples r china ; [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa
KeywordElectromigration Single Crystal Tin Cu6sn5 Intermetallic Compounds Orientation Diffusion
Subject AreaChemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
Funding OrganizationNatural Science Foundation of China [51171191]; National key Scientific Instrument and Equipment development projects of China [2013YQ120355]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78146
Collection中国科学院金属研究所
Corresponding AuthorGuo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Recommended Citation
GB/T 7714
Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,et al. Electromigration anisotropy introduced by tin orientation in solder joints[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2017,703:264-271.
APA Chen, Jian-Qiang.,Liu, Kai-Lang.,Guo, Jing-Dong.,Ma, Hui-Cai.,Wei, Song.,...&Guo, JD .(2017).Electromigration anisotropy introduced by tin orientation in solder joints.JOURNAL OF ALLOYS AND COMPOUNDS,703,264-271.
MLA Chen, Jian-Qiang,et al."Electromigration anisotropy introduced by tin orientation in solder joints".JOURNAL OF ALLOYS AND COMPOUNDS 703(2017):264-271.
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