IMR OpenIR
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li; Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
2017-05-01
发表期刊MATERIALS
ISSN1996-1944
卷号10期号:5页码:-
摘要With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.; With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.
部门归属[yang, fan ; zhang, liang] jiangsu normal univ, sch mech & elect engn, xuzhou 221116, peoples r china ; [zhang, liang ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [zhong, su juan ; ma, jia ; bao, li] zhengzhou inst mech engn, state key lab adv brazing filler met & technol, zhengzhou 450001, peoples r china
关键词Sn-58bi Solder Lead-free Solder Microstructure
学科领域Materials Science, Multidisciplinary
资助者Research Innovation Project for College Graduate of Jiangsu Province [KYZZ16_0469]; Natural Science Foundation of China [51475220]; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) [SKLABFMT-2015-03]; High Level Talent Plan of Jiangsu Normal University [YQ2015002]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/78148
专题中国科学院金属研究所
通讯作者Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
推荐引用方式
GB/T 7714
Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder[J]. MATERIALS,2017,10(5):-.
APA Yang, Fan.,Zhang, Liang.,Liu, Zhi-quan.,Zhong, Su Juan.,Ma, Jia.,...&Zhang, L .(2017).Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.MATERIALS,10(5),-.
MLA Yang, Fan,et al."Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder".MATERIALS 10.5(2017):-.
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