IMR OpenIR
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li; Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
2017-05-01
Source PublicationMATERIALS
ISSN1996-1944
Volume10Issue:5Pages:-
AbstractWith the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.; With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.
description.department[yang, fan ; zhang, liang] jiangsu normal univ, sch mech & elect engn, xuzhou 221116, peoples r china ; [zhang, liang ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [zhong, su juan ; ma, jia ; bao, li] zhengzhou inst mech engn, state key lab adv brazing filler met & technol, zhengzhou 450001, peoples r china
KeywordSn-58bi Solder Lead-free Solder Microstructure
Subject AreaMaterials Science, Multidisciplinary
Funding OrganizationResearch Innovation Project for College Graduate of Jiangsu Province [KYZZ16_0469]; Natural Science Foundation of China [51475220]; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) [SKLABFMT-2015-03]; High Level Talent Plan of Jiangsu Normal University [YQ2015002]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78148
Collection中国科学院金属研究所
Corresponding AuthorZhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Recommended Citation
GB/T 7714
Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder[J]. MATERIALS,2017,10(5):-.
APA Yang, Fan.,Zhang, Liang.,Liu, Zhi-quan.,Zhong, Su Juan.,Ma, Jia.,...&Zhang, L .(2017).Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.MATERIALS,10(5),-.
MLA Yang, Fan,et al."Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder".MATERIALS 10.5(2017):-.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Yang, Fan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-quan]'s Articles
Baidu academic
Similar articles in Baidu academic
[Yang, Fan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-quan]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Yang, Fan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-quan]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.