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| Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer | |
| Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan; Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. | |
| 2017-04-01 | |
| Source Publication | MATERIALS
 |
| ISSN | 1996-1944 |
| Volume | 10Issue:4Pages:- |
| Abstract | Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.; Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer. |
| description.department | [zhang, liang ; yang, fan] jiangsu normal univ, sch mechatron engn, xuzhou 221116, peoples r china ; [zhang, liang ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [zhong, su-juan] zhengzhou res inst mech engn, state key lab adv brazing filler met & technol, zhengzhou 450001, peoples r china |
| Keyword | Cu6sn5 Whiskers Ag3sn Fibers Mechanical Property Screw Dislocation |
| Subject Area | Materials Science, Multidisciplinary |
| Funding Organization | Natural Science Foundation of China [51475220]; Qing Lan Project; China Postdoctoral Science Foundation [2016M591464]; Six talent peaks project in Jiangsu Province [XCL-022]; State Foundation of Laboratory of Advanced Brazing Filler Metals Technology [SKLABFMT-2015-03] |
| Indexed By | SCI |
| Language | 英语 |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/78195 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| Recommended Citation GB/T 7714 | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,et al. Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer[J]. MATERIALS,2017,10(4):-. |
| APA | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,Zhong, Su-juan,Zhang, L ,&Zhang, L .(2017).Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.MATERIALS,10(4),-. |
| MLA | Zhang, Liang,et al."Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer".MATERIALS 10.4(2017):-. |
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