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Mechanically-induced grain coarsening in gradient nano-grained copper
Chen, W.; You, Z. S.; Tao, N. R.; Jin, Z. H.; Lu, L.; Lu, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.; Jin, ZH (reprint author), Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, 800 Dongchuan Rd, Shanghai 200240, Peoples R China.
2017-02-15
Source PublicationACTA MATERIALIA
ISSN1359-6454
Volume125Pages:255-264
AbstractGradient nano-grained Cu subjected to tensile tests yields at a stress almost twice of that of the conventional coarse-grained Cu at or below the room temperature. Beyond the yield stress, a uniform plastic strain of larger than 30% can be achieved, accompanied by homogeneous grain coarsening in nano-grained surface layer. The observed grain coarsening may induce certain degree of "strain softening". The measured grain coarsening rates strongly depend on temperature, stress and strain rate, suggesting that the grain coarsening is presumably limited by thermally activated dislocation activities at defective grain boundaries, rather than via diffusional process on atom-by-atom basis. A non-diffusional (source limited) Mott-Turnbull rate equation has been proposed to interpret the observed grain coarsening phenomenon. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.; Gradient nano-grained Cu subjected to tensile tests yields at a stress almost twice of that of the conventional coarse-grained Cu at or below the room temperature. Beyond the yield stress, a uniform plastic strain of larger than 30% can be achieved, accompanied by homogeneous grain coarsening in nano-grained surface layer. The observed grain coarsening may induce certain degree of "strain softening". The measured grain coarsening rates strongly depend on temperature, stress and strain rate, suggesting that the grain coarsening is presumably limited by thermally activated dislocation activities at defective grain boundaries, rather than via diffusional process on atom-by-atom basis. A non-diffusional (source limited) Mott-Turnbull rate equation has been proposed to interpret the observed grain coarsening phenomenon. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
description.department[chen, w. ; you, z. s. ; tao, n. r. ; lu, l.] chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china ; [you, z. s.] nanjing univ sci & technol, herbert gleiter inst nanosci, 200 xiaolingwei st, nanjing 210094, jiangsu, peoples r china ; [jin, z. h.] shanghai jiao tong univ, sch mat sci & engn, 800 dongchuan rd, shanghai 200240, peoples r china
KeywordGradient Nano-grained Copper Grain Coarsening Grain Boundary Migration Non-diffusional Kinetics Deformation Mechanisms
Subject AreaMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
Funding OrganizationNational Science Foundation of China [51420105001, 51171181, 51371171, 51471172, 51401211]; Key Research Program of Frontier Sciences, CAS; National Basic Research Program of China (973 Program) [2012CB932202]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78289
Collection中国科学院金属研究所
Corresponding AuthorLu, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.; Jin, ZH (reprint author), Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, 800 Dongchuan Rd, Shanghai 200240, Peoples R China.
Recommended Citation
GB/T 7714
Chen, W.,You, Z. S.,Tao, N. R.,et al. Mechanically-induced grain coarsening in gradient nano-grained copper[J]. ACTA MATERIALIA,2017,125:255-264.
APA Chen, W..,You, Z. S..,Tao, N. R..,Jin, Z. H..,Lu, L..,...&Jin, ZH .(2017).Mechanically-induced grain coarsening in gradient nano-grained copper.ACTA MATERIALIA,125,255-264.
MLA Chen, W.,et al."Mechanically-induced grain coarsening in gradient nano-grained copper".ACTA MATERIALIA 125(2017):255-264.
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