Mechanically-induced grain coarsening in gradient nano-grained copper

IMR OpenIR

	Mechanically-induced grain coarsening in gradient nano-grained copper
	Chen, W.; You, Z. S.; Tao, N. R.; Jin, Z. H.; Lu, L.; Lu, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.; Jin, ZH (reprint author), Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, 800 Dongchuan Rd, Shanghai 200240, Peoples R China.
	2017-02-15
发表期刊	ACTA MATERIALIA
ISSN	1359-6454
卷号	125 页码:255-264
摘要	Gradient nano-grained Cu subjected to tensile tests yields at a stress almost twice of that of the conventional coarse-grained Cu at or below the room temperature. Beyond the yield stress, a uniform plastic strain of larger than 30% can be achieved, accompanied by homogeneous grain coarsening in nano-grained surface layer. The observed grain coarsening may induce certain degree of "strain softening". The measured grain coarsening rates strongly depend on temperature, stress and strain rate, suggesting that the grain coarsening is presumably limited by thermally activated dislocation activities at defective grain boundaries, rather than via diffusional process on atom-by-atom basis. A non-diffusional (source limited) Mott-Turnbull rate equation has been proposed to interpret the observed grain coarsening phenomenon. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.; Gradient nano-grained Cu subjected to tensile tests yields at a stress almost twice of that of the conventional coarse-grained Cu at or below the room temperature. Beyond the yield stress, a uniform plastic strain of larger than 30% can be achieved, accompanied by homogeneous grain coarsening in nano-grained surface layer. The observed grain coarsening may induce certain degree of "strain softening". The measured grain coarsening rates strongly depend on temperature, stress and strain rate, suggesting that the grain coarsening is presumably limited by thermally activated dislocation activities at defective grain boundaries, rather than via diffusional process on atom-by-atom basis. A non-diffusional (source limited) Mott-Turnbull rate equation has been proposed to interpret the observed grain coarsening phenomenon. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[chen, w. ; you, z. s. ; tao, n. r. ; lu, l.] chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china ; [you, z. s.] nanjing univ sci & technol, herbert gleiter inst nanosci, 200 xiaolingwei st, nanjing 210094, jiangsu, peoples r china ; [jin, z. h.] shanghai jiao tong univ, sch mat sci & engn, 800 dongchuan rd, shanghai 200240, peoples r china
关键词	Gradient Nano-grained Copper Grain Coarsening Grain Boundary Migration Non-diffusional Kinetics Deformation Mechanisms
学科领域	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
资助者	National Science Foundation of China [51420105001, 51171181, 51371171, 51471172, 51401211]; Key Research Program of Frontier Sciences, CAS; National Basic Research Program of China (973 Program) [2012CB932202]
收录类别	SCI
语种	英语
WOS记录号	WOS:000394201500025
引用统计	被引频次：118[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/78289
专题	中国科学院金属研究所
通讯作者	Lu, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.; Jin, ZH (reprint author), Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, 800 Dongchuan Rd, Shanghai 200240, Peoples R China.
推荐引用方式 GB/T 7714	Chen, W.,You, Z. S.,Tao, N. R.,et al. Mechanically-induced grain coarsening in gradient nano-grained copper[J]. ACTA MATERIALIA,2017,125:255-264.
APA	Chen, W..,You, Z. S..,Tao, N. R..,Jin, Z. H..,Lu, L..,...&Jin, ZH .(2017).Mechanically-induced grain coarsening in gradient nano-grained copper.ACTA MATERIALIA,125,255-264.
MLA	Chen, W.,et al."Mechanically-induced grain coarsening in gradient nano-grained copper".ACTA MATERIALIA 125(2017):255-264.