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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating
Zhao, Sheng-Sheng; Zhao, Yan-Hui; Cheng, Lv-Sha; Denisov, Vladimir Viktorovich; Koval, Nikolay Nikolaevich; Yu, Bao-Hai; Mei, Hai-Juan; Zhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China.
2017-02-01
发表期刊ACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN1006-7191
卷号30期号:2页码:176-184
摘要Ti-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance.; Ti-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance.
部门归属[zhao, sheng-sheng ; cheng, lv-sha ; mei, hai-juan] shenzhen polytech, sch mech & elect engn, shenzhen 518055, peoples r china ; [zhao, yan-hui ; yu, bao-hai] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [denisov, vladimir viktorovich ; koval, nikolay nikolaevich] russian acad sci, inst high current elect, siberian branch, akad skii pr 2-3, tomsk 634055, russia
关键词Magnetic Field Arc Ion Plating Ti-cu-n Film Residual Stress Hardness
学科领域Metallurgy & Metallurgical Engineering
资助者National Natural Science Foundation of China [51401128]; Shenzhen Science and Technology Project [JCYJ20140508155916426]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/78302
专题中国科学院金属研究所
通讯作者Zhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China.
推荐引用方式
GB/T 7714
Zhao, Sheng-Sheng,Zhao, Yan-Hui,Cheng, Lv-Sha,et al. Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2017,30(2):176-184.
APA Zhao, Sheng-Sheng.,Zhao, Yan-Hui.,Cheng, Lv-Sha.,Denisov, Vladimir Viktorovich.,Koval, Nikolay Nikolaevich.,...&Zhao, SS .(2017).Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating.ACTA METALLURGICA SINICA-ENGLISH LETTERS,30(2),176-184.
MLA Zhao, Sheng-Sheng,et al."Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating".ACTA METALLURGICA SINICA-ENGLISH LETTERS 30.2(2017):176-184.
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