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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating
Zhao, Sheng-Sheng; Zhao, Yan-Hui; Cheng, Lv-Sha; Denisov, Vladimir Viktorovich; Koval, Nikolay Nikolaevich; Yu, Bao-Hai; Mei, Hai-Juan; Zhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China.
2017-02-01
Source PublicationACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN1006-7191
Volume30Issue:2Pages:176-184
AbstractTi-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance.; Ti-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance.
description.department[zhao, sheng-sheng ; cheng, lv-sha ; mei, hai-juan] shenzhen polytech, sch mech & elect engn, shenzhen 518055, peoples r china ; [zhao, yan-hui ; yu, bao-hai] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [denisov, vladimir viktorovich ; koval, nikolay nikolaevich] russian acad sci, inst high current elect, siberian branch, akad skii pr 2-3, tomsk 634055, russia
KeywordMagnetic Field Arc Ion Plating Ti-cu-n Film Residual Stress Hardness
Subject AreaMetallurgy & Metallurgical Engineering
Funding OrganizationNational Natural Science Foundation of China [51401128]; Shenzhen Science and Technology Project [JCYJ20140508155916426]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78302
Collection中国科学院金属研究所
Corresponding AuthorZhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China.
Recommended Citation
GB/T 7714
Zhao, Sheng-Sheng,Zhao, Yan-Hui,Cheng, Lv-Sha,et al. Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2017,30(2):176-184.
APA Zhao, Sheng-Sheng.,Zhao, Yan-Hui.,Cheng, Lv-Sha.,Denisov, Vladimir Viktorovich.,Koval, Nikolay Nikolaevich.,...&Zhao, SS .(2017).Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating.ACTA METALLURGICA SINICA-ENGLISH LETTERS,30(2),176-184.
MLA Zhao, Sheng-Sheng,et al."Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating".ACTA METALLURGICA SINICA-ENGLISH LETTERS 30.2(2017):176-184.
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