IMR OpenIR
3DIC封装中铜柱凸点和硅通孔互连的可靠性
马会财
Subtype博士
Thesis Advisor尚建库 郭敬东
2017
Language中文
Document Type学位论文
Identifierhttp://ir.imr.ac.cn/handle/321006/78434
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
马会财. 3DIC封装中铜柱凸点和硅通孔互连的可靠性[D],2017.
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