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题名: High coercivity and squareness realized in polycrystalline AlN-buffered Cu-doped Sm-Co thin films with perpendicular anisotropy
作者: Zhang, Tongbo;  Yang, Yang;  Xie, Yigao;  Fu, Yanqing;  Cui, Weibin;  Zhao, Xinguo;  Liu, Wei;  Zhang, Zhidong;  Wang, Qiang
发表日期: 2017-12-30
摘要: A polycrystalline AlN underlayer prepared by reactive sputtering has been used for the preparation of SmCo3.5Cu0.5 thin films with varying thickness. The out-of-plane (OOP) texture is confirmed by X-ray diffraction and magnetic measurements. A highest ambient coercivity of 2.92 T is obtained with good squareness. The microstructure shows columnar grains and a high density of stacking faults. Additionally, a twinning structure is found. The thermal stability of the coercivity of AlN-buffered SmCo3.5Cu0.5 thin films has been investigated in correlation with the microstructure. The present work demonstrates the great potential of using AlN underlayer for the preparation high-performance Sm-(Co, Cu) thin films with OOP texture. (C) 2017 Elsevier B.V. All rights reserved.
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Recommended Citation:
Zhang, Tongbo,Yang, Yang,Xie, Yigao,et al. High Coercivity And Squareness Realized In Polycrystalline Aln-buffered Cu-doped Sm-co Thin Films With Perpendicular Anisotropy[J]. Elsevier Science Sa,2017,729:533-537.

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