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Transport properties of MnTe films with cracks produced in thermal cycling process
Yang, Liang; Wang, Zhenhua; Zhang, Zhidong; Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
2017-10-01
发表期刊SPRINGER
ISSN0947-8396
卷号123期号:10页码:-
摘要As a promising material in antiferromagnetic spintronics, MnTe films manifested complex characteristics according to previous reports. In this work, we investigate in details the temperature dependence of resistivity of MnTe films grown on SiO2/Si substrate and focus on the divaricating of cooling and warming resistivity-temperature (R-T) curves. It is found that such a divaricating in resistivity is associated with cracks produced in thermal cycles. By comparing the crystalline character and the morphology before and after the cycles, we verify the appearance of cracks and the release of stress in the films. Based on the temperature dependence of thermal-expansion coefficient of Si and MnTe, the origin of the cracks is the mismatched thermal-expansion coefficient (a). The humps, which only appear in the R-T curve of the first cooling process, are attributed to the produced cracks and/or the unreleased stress.; As a promising material in antiferromagnetic spintronics, MnTe films manifested complex characteristics according to previous reports. In this work, we investigate in details the temperature dependence of resistivity of MnTe films grown on SiO2/Si substrate and focus on the divaricating of cooling and warming resistivity-temperature (R-T) curves. It is found that such a divaricating in resistivity is associated with cracks produced in thermal cycles. By comparing the crystalline character and the morphology before and after the cycles, we verify the appearance of cracks and the release of stress in the films. Based on the temperature dependence of thermal-expansion coefficient of Si and MnTe, the origin of the cracks is the mismatched thermal-expansion coefficient (a). The humps, which only appear in the R-T curve of the first cooling process, are attributed to the produced cracks and/or the unreleased stress.
部门归属[yang, liang ; wang, zhenhua ; zhang, zhidong] univ chinese acad sci, chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, liaoning, peoples r china
学科领域Materials Science, Multidisciplinary ; Physics, Applied
资助者National Natural Science Foundation of China [51522104, 51331006]; National Key R&D Program of China [2017YFA0206302]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/79051
专题中国科学院金属研究所
通讯作者Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
推荐引用方式
GB/T 7714
Yang, Liang,Wang, Zhenhua,Zhang, Zhidong,et al. Transport properties of MnTe films with cracks produced in thermal cycling process[J]. SPRINGER,2017,123(10):-.
APA Yang, Liang,Wang, Zhenhua,Zhang, Zhidong,&Wang, ZH .(2017).Transport properties of MnTe films with cracks produced in thermal cycling process.SPRINGER,123(10),-.
MLA Yang, Liang,et al."Transport properties of MnTe films with cracks produced in thermal cycling process".SPRINGER 123.10(2017):-.
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