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Wettability of molten Sn on AlCoCrCuxFeNi high-entropy alloy
Ma, G. F.; Ye, H.; Zhang, H. L.; He, C. L.; Zhang, H. F.; Zhang, HL (reprint author), Shenyang Univ, Key Lab Adv Mat Technol, Educ Dept Liaoning Prov, Shenyang 110044, Liaoning, Peoples R China.
2017-09-15
发表期刊ELSEVIER SCIENCE SA
ISSN0254-0584
卷号199页码:1-6
摘要Wettability between the molten Sn and AlCoCrCuxFeNi (x = 0, 0.5, 1, 1.5) high-entropy alloy (HEA) substrates was studied by sessile drop technique at 823 K. The final contact angle decreased with the increase of Cu content in the AlCoCrFeNi HEA. Additional Cu could not only change surface structure of AlCoCrFeNi HEA but also effect on the interfacial reaction between the molten Sn and AlCoCrCuxFeNi HEA. Moreover, with the increasing concentration of Cu, the diffusion of Sn atom along the Cu-rich solid solution phase in AlCoCrCuxFeNi HEA was much more intense. Accordingly, the enhancement of wetting may be attributed to change of the primary interface reaction product and diffusion of Sn atom along the Cu-rich solid-solution phase. (C) 2017 Elsevier B.V. All rights reserved.; Wettability between the molten Sn and AlCoCrCuxFeNi (x = 0, 0.5, 1, 1.5) high-entropy alloy (HEA) substrates was studied by sessile drop technique at 823 K. The final contact angle decreased with the increase of Cu content in the AlCoCrFeNi HEA. Additional Cu could not only change surface structure of AlCoCrFeNi HEA but also effect on the interfacial reaction between the molten Sn and AlCoCrCuxFeNi HEA. Moreover, with the increasing concentration of Cu, the diffusion of Sn atom along the Cu-rich solid solution phase in AlCoCrCuxFeNi HEA was much more intense. Accordingly, the enhancement of wetting may be attributed to change of the primary interface reaction product and diffusion of Sn atom along the Cu-rich solid-solution phase. (C) 2017 Elsevier B.V. All rights reserved.
部门归属[ma, g. f. ; zhang, h. l. ; he, c. l.] shenyang univ, key lab adv mat technol, educ dept liaoning prov, shenyang 110044, liaoning, peoples r china ; [ye, h.] curtin univ, dept chem engn, gpo box u1987, bentley, wa 6845, australia ; [zhang, h. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, liaoning, peoples r china
关键词High-entropy Alloy Wettability Cu Content Interface Diffusion
学科领域Materials Science, Multidisciplinary
资助者China Postdoctoral Science Foundation [2016M601333]; Liaoning Provincial Natural Science Foundation of China [201602518]; Liaoning province department of education fund [LJQ2014134]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/79096
专题中国科学院金属研究所
通讯作者Zhang, HL (reprint author), Shenyang Univ, Key Lab Adv Mat Technol, Educ Dept Liaoning Prov, Shenyang 110044, Liaoning, Peoples R China.
推荐引用方式
GB/T 7714
Ma, G. F.,Ye, H.,Zhang, H. L.,et al. Wettability of molten Sn on AlCoCrCuxFeNi high-entropy alloy[J]. ELSEVIER SCIENCE SA,2017,199:1-6.
APA Ma, G. F.,Ye, H.,Zhang, H. L.,He, C. L.,Zhang, H. F.,&Zhang, HL .(2017).Wettability of molten Sn on AlCoCrCuxFeNi high-entropy alloy.ELSEVIER SCIENCE SA,199,1-6.
MLA Ma, G. F.,et al."Wettability of molten Sn on AlCoCrCuxFeNi high-entropy alloy".ELSEVIER SCIENCE SA 199(2017):1-6.
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