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题名: Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
作者: Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.
发表日期: 2017-7-31
摘要: In this study, the viscoplastic creep behaviors of the Sn-4Ag/Cu, Sn-3Cu/Cu and Sn-58Bi/Cu solder joints under shear stress were in-situ observed, and the evolutions in microstructure of the solders were characterized by in situ EBSD. The results reveal that the creep strain of the Sn-Cu and Sn-Ag solders increase linearly with increasing time. Deformation of the Sn-Cu solder concentrates in some parallel shear bands, while deformation of the Sn-Ag solder is relatively uniform, and the deformation concentration along the joint interface is not obvious for the two solders. The strain concentration around the fine Ag3Sn particles in the Sn-Ag solder is not obvious, while the strain concentration around the large Cu6Sn5 grain in the Sn-Cu solder is serious and result in fracture of the Cu6Sn5 grain. Dynamic high-temperature recovery occurs in the Sn-Ag and Sn-Cu solders, result in grain boundary migration, polygonization and formation of a few low-angle grain boundaries. The Sn-Bi solder deforms through grain boundary sliding and phase boundary sliding, the strain increase exponentially with increasing time, and its grain structure is stable during the deformation process.
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
Zhang, Q. K.,Hu, F. Q.,Song, Z. L.,et al. Viscoplastic Creep And Microstructure Evolution Of Sn-based Lead-free Solders At Low Strain[J]. Elsevier Science Sa,2017,701:187-195.

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