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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability
Shi, QY; Liu, ZQ; Wu, D; Zhang, H; Ni, DR; Suganuma, K; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.; Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
2018-05-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume29Issue:10Pages:8371-8379
AbstractAlthough the diamond/Al composite is a good heat sink material due to its high thermal conductivity and low cost, its surface cannot be wetted directly for microelectronic packaging. Using modified electroless plating procedures and recipes, a glossy, continuous, and uniform Ni-P film was successfully fabricated on the diamond/Al composite surface for the first time with a bonding strength of 15.1 MPa. This Ni-P coating layer is solderable for both lead-free SAC305 and Sn63Pb37 alloys on Cu dummy chips. A continuous intermetallic compound (IMC) layer was formed at the interface without any crack or void defects, and the shear strength of both solder joints was in the range of 39.9-41.2 MPa. During thermal storage tests, the growth of IMC was slow at 125 and 150 A degrees C, but it elevated sharply at 175 A degrees C. According to growth kinetics analyses, a Ni element can hinder IMC growth. The diffusion activation energy (Q) of (Cu,Ni)(6)Sn-5 was calculated as 62.6 kJ/mol in SAC305 and 97.7 kJ/mol in Sn63Pb37 solder joints. Both microstructures and mechanical properties of the solder joint using the Ni-P coated diamond/Al composite can satisfy the requirement of microelectronic industrial applications.; Although the diamond/Al composite is a good heat sink material due to its high thermal conductivity and low cost, its surface cannot be wetted directly for microelectronic packaging. Using modified electroless plating procedures and recipes, a glossy, continuous, and uniform Ni-P film was successfully fabricated on the diamond/Al composite surface for the first time with a bonding strength of 15.1 MPa. This Ni-P coating layer is solderable for both lead-free SAC305 and Sn63Pb37 alloys on Cu dummy chips. A continuous intermetallic compound (IMC) layer was formed at the interface without any crack or void defects, and the shear strength of both solder joints was in the range of 39.9-41.2 MPa. During thermal storage tests, the growth of IMC was slow at 125 and 150 A degrees C, but it elevated sharply at 175 A degrees C. According to growth kinetics analyses, a Ni element can hinder IMC growth. The diffusion activation energy (Q) of (Cu,Ni)(6)Sn-5 was calculated as 62.6 kJ/mol in SAC305 and 97.7 kJ/mol in Sn63Pb37 solder joints. Both microstructures and mechanical properties of the solder joint using the Ni-P coated diamond/Al composite can satisfy the requirement of microelectronic industrial applications.
description.department[shi, qi-yuan ; liu, zhi-quan ; wu, di ; ni, ding-rui] chinese acad sci, inst met res, shenyang 110016, liaoning, peoples r china ; [shi, qi-yuan ; liu, zhi-quan] univ sci & technol china, sch mat sci & engn, shenyang 110016, liaoning, peoples r china ; [liu, zhi-quan ; zhang, hao ; suganuma, katsuaki] osaka univ, inst sci & ind res, osaka 5670047, japan
KeywordAl/diamond Composites Thermal-conductivity Coated Diamond Heat Sinks Densification Microstructure Mechanisms Strength Surface Growth
Subject AreaEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
Funding OrganizationNational Key R&D Program of China [2017YFB0305501]; Innovation Fund Project of IMR, CAS [2015-ZD02]; Osaka University Visiting Scholar Program [J135104902]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/79329
Collection中国科学院金属研究所
Corresponding AuthorLiu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.; Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Recommended Citation
GB/T 7714
Shi, QY,Liu, ZQ,Wu, D,et al. Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(10):8371-8379.
APA Shi, QY.,Liu, ZQ.,Wu, D.,Zhang, H.,Ni, DR.,...&Zhang, H .(2018).Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(10),8371-8379.
MLA Shi, QY,et al."Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.10(2018):8371-8379.
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