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题名: The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
作者: Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ
发表日期: 2018-4-5
摘要: Intermetallic compounds (IMCs) with three different morphologies were formed through an interfacial reaction between In-48Sn solder and polycrystalline Cu substrate, which are chunk-type Cu(In,Sn)(2) and duplex structural Cu-2(In,Sn). Two types of phase transformations between Cu(In,Sn)(2) and Cu-2(In,Sn) IMCs occurred during low temperature aging (20 degrees C and 40 degrees C) and high temperature aging (60 degrees C, 80 degrees C and 100 degrees C), respectively. At lower aging temperature, the duplex structural coarse-grain and fine-grain Cu-2(In,Sn) transformed into Cu(In,Sn)(2), and a characteristic evolution model was provided. At a higher aging temperature, Cu(In,Sn)(2) transformed completely into Cu-2(In,Sn) within a very short time period. Based on the designed Cr-marker experiments, the growth kinetics of coarse-grain and fine-grain Cu-2(In,Sn) sublayers at higher aging temperatures were investigated. It was concluded that the growth mechanism of Cu-2(In,Sn) is temperature dependent, which is volume-diffusion-controlled at 60 degrees C-80 degrees C, whereas grain boundary diffusion becomes rate-controlling at 100 degrees C. Through an elaborate design of aging test at 80 degrees C and 20 degrees C alternately, the reversible transformation between Cu-2(In,Sn) and Cu(In,Sn)(2) was observed and characterised. (C) 2017 Elsevier B.V. All rights reserved.
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Recommended Citation:
Tian, FF,Li, CF,Zhou, M,et al. The Interfacial Reaction Between In-48sn Solder And Polycrystalline Cu Substrate During Solid State Aging[J]. Journal Of Alloys And Compounds,2018,740:500-509.

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