The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage

IMR OpenIR

	The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
	Gao, LY; Li, CF; Wan, P; Zhang, H; Liu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
	2018-03-30
发表期刊	JOURNAL OF ALLOYS AND COMPOUNDS
ISSN	0925-8388
卷号	739 页码:632-642
摘要	High temperature storage was conducted on SnAgCu/Fe-Ni (73 wt% Ni and 45 wt% Ni) as well as SnAgCu/Cu solder joints at 125 degrees C, 150 degrees C, and 175 degrees C to evaluate the diffusion barrier effect of Fe-Ni under bump metallization (UBM). For Fe-73Ni solder joints, rod-like (Cu, Ni)(6)Sn-5 finally accumulated in the form of a continuous outer layer on the FeSn2 layer, as the aging time increased. Compared to Cu UBM, the Fe-73Ni UBM showed a better diffusion barrier effect at 125 degrees C and 150 degrees C. However, when the temperature increased to 175 degrees C, the inter-diffusion between FeSn2 and (Cu, Ni)(6)Sn-5 generated a mixed IMC layer, which further transformed into the (Ni, Cu)(3)Sn-4 phase which was accompanied with an abrupt increase of IMC thickness and rapid dissolution of UBM. In terms of the SAC/Fe-45Ni solder joints, the growth rate of (Cu, Ni)(6)Sn-5 and the transformation of (Ni, Cu)(3)Sn-4 were both suppressed, resulting in a compact FeSn2 layer and a higher Fe content after the UBM. As a result, the Fe-45Ni UBM showed an excellent diffusion barrier effect from 125 degrees C to 175 degrees C, as compared to the Cu and Fe-73Ni UBM. Using the statistical thicknesses of the interfacial intermetallic compounds (IMCs), the activation energies of the diffusion controlled growth of FeSn2 and (Cu, Ni)(6)Sn-5 in Fe-45Ni solder joints were calculated as 106 kJ/mol and 122 kJ/mol, which were higher than that for the Cu3Sn (97 kJ/mol) and Cu6Sn5 (86 kJ/mol) in the Cu solder joints. (c) 2017 Elsevier B.V. All rights reserved.; High temperature storage was conducted on SnAgCu/Fe-Ni (73 wt% Ni and 45 wt% Ni) as well as SnAgCu/Cu solder joints at 125 degrees C, 150 degrees C, and 175 degrees C to evaluate the diffusion barrier effect of Fe-Ni under bump metallization (UBM). For Fe-73Ni solder joints, rod-like (Cu, Ni)(6)Sn-5 finally accumulated in the form of a continuous outer layer on the FeSn2 layer, as the aging time increased. Compared to Cu UBM, the Fe-73Ni UBM showed a better diffusion barrier effect at 125 degrees C and 150 degrees C. However, when the temperature increased to 175 degrees C, the inter-diffusion between FeSn2 and (Cu, Ni)(6)Sn-5 generated a mixed IMC layer, which further transformed into the (Ni, Cu)(3)Sn-4 phase which was accompanied with an abrupt increase of IMC thickness and rapid dissolution of UBM. In terms of the SAC/Fe-45Ni solder joints, the growth rate of (Cu, Ni)(6)Sn-5 and the transformation of (Ni, Cu)(3)Sn-4 were both suppressed, resulting in a compact FeSn2 layer and a higher Fe content after the UBM. As a result, the Fe-45Ni UBM showed an excellent diffusion barrier effect from 125 degrees C to 175 degrees C, as compared to the Cu and Fe-73Ni UBM. Using the statistical thicknesses of the interfacial intermetallic compounds (IMCs), the activation energies of the diffusion controlled growth of FeSn2 and (Cu, Ni)(6)Sn-5 in Fe-45Ni solder joints were calculated as 106 kJ/mol and 122 kJ/mol, which were higher than that for the Cu3Sn (97 kJ/mol) and Cu6Sn5 (86 kJ/mol) in the Cu solder joints. (c) 2017 Elsevier B.V. All rights reserved.
部门归属	[gao, li-yin ; li, cai-fu ; wan, peng ; zhang, hao ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, liaoning, peoples r china ; [gao, li-yin ; wan, peng ; liu, zhi-quan] univ chinese acad sci, beijing 100049, peoples r china ; [li, cai-fu ; zhang, hao ; liu, zhi-quan] osaka univ, inst sci & ind res, osaka 5670047, japan
关键词	Lead-free Solders Interfacial Reactions Sn-ag Intermetallic Compounds Rich Solders Joints Growth Reliability Substrate Strength
学科领域	Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
资助者	National Key R&D Program of China [2017YFB0305501]; Natural Science Foundation of China [51401218]; Osaka University Visiting Scholar Program [J135104902]
收录类别	SCI
语种	英语
WOS记录号	WOS:000425491800077
引用统计	被引频次：20[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/79418
专题	中国科学院金属研究所
通讯作者	Li, CF; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
推荐引用方式 GB/T 7714	Gao, LY,Li, CF,Wan, P,et al. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,739:632-642.
APA	Gao, LY.,Li, CF.,Wan, P.,Zhang, H.,Liu, ZQ.,...&Liu, ZQ .(2018).The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage.JOURNAL OF ALLOYS AND COMPOUNDS,739,632-642.
MLA	Gao, LY,et al."The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage".JOURNAL OF ALLOYS AND COMPOUNDS 739(2018):632-642.