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Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel
Fan, D; Lei, H; Guo, CQ; Qi, DL; Gong, J; Sun, C; Sun, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
2018-03-01
Source PublicationACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN1006-7191
Volume31Issue:3Pages:329-336
AbstractThe reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa under general deposition conditions. Stress in the CrN thin films with different thicknesses ranging from 110 to 330 nm on stainless steel was studied by this method, in comparison with conventional results on silicon wafer. The thin films' morphology and structure were investigated and related to the film stress. A significant result of the comparison is that stress evolution in the thin films on steel obviously differs from that on silicon wafer, not only because the two substrates have different coefficients of thermal expansion, which provokes thermal stress, but also the considerable discrepancy in the thin films' grain coarsening rate and structure that induce different intrinsic stresses.; The reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa under general deposition conditions. Stress in the CrN thin films with different thicknesses ranging from 110 to 330 nm on stainless steel was studied by this method, in comparison with conventional results on silicon wafer. The thin films' morphology and structure were investigated and related to the film stress. A significant result of the comparison is that stress evolution in the thin films on steel obviously differs from that on silicon wafer, not only because the two substrates have different coefficients of thermal expansion, which provokes thermal stress, but also the considerable discrepancy in the thin films' grain coarsening rate and structure that induce different intrinsic stresses.
description.department[fan, di ; lei, hao ; guo, chao-qian ; gong, jun ; sun, chao] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [fan, di] univ chinese acad sci, beijing 100049, peoples r china ; [qi, dong-li] shenyang ligong univ, sch sci, shenyang 110159, peoples r china
KeywordChromium Nitride Films Compressive Stress Residual-stresses Intrinsic Stress Magnetron Evolution Coatings Microstructure Deposition Profiles
Subject AreaMetallurgy & Metallurgical Engineering
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/79455
Collection中国科学院金属研究所
Corresponding AuthorLei, H; Sun, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Recommended Citation
GB/T 7714
Fan, D,Lei, H,Guo, CQ,et al. Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2018,31(3):329-336.
APA Fan, D.,Lei, H.,Guo, CQ.,Qi, DL.,Gong, J.,...&Sun, C .(2018).Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel.ACTA METALLURGICA SINICA-ENGLISH LETTERS,31(3),329-336.
MLA Fan, D,et al."Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel".ACTA METALLURGICA SINICA-ENGLISH LETTERS 31.3(2018):329-336.
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