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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
Zhu, QS; Gao, F; Ma, HC; Liu, ZQ; Guo, JD; Zhang, L; Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
2018-03-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume29Issue:6Pages:5025-5033
AbstractIn this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.; In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.
description.department[zhu, q. s. ; gao, f. ; ma, h. c. ; liu, z. q. ; guo, j. d.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, liaoning, peoples r china ; [zhang, l.] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
KeywordStress-relaxation Void Formation Electromigration Reliability Sn Interconnections Thermomigration Metallization Mechanisms Diffusion
Subject AreaEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
Funding OrganizationNational Natural Science Foundation of China (NSFC) [51471180, 51101161]; Science and Technology Program of Shenyang [F16-205-1-18]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/79464
Collection中国科学院金属研究所
Corresponding AuthorZhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
Recommended Citation
GB/T 7714
Zhu, QS,Gao, F,Ma, HC,et al. Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5025-5033.
APA Zhu, QS.,Gao, F.,Ma, HC.,Liu, ZQ.,Guo, JD.,...&Zhu, QS .(2018).Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(6),5025-5033.
MLA Zhu, QS,et al."Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.6(2018):5025-5033.
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