Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current

IMR OpenIR

	Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
	Zhu, QS; Gao, F; Ma, HC; Liu, ZQ; Guo, JD; Zhang, L; Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
	2018-03-01
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	29 期号:6 页码:5025-5033
摘要	In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.; In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.
部门归属	[zhu, q. s. ; gao, f. ; ma, h. c. ; liu, z. q. ; guo, j. d.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, liaoning, peoples r china ; [zhang, l.] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china
关键词	Stress-relaxation Void Formation Electromigration Reliability Sn Interconnections Thermomigration Metallization Mechanisms Diffusion
学科领域	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
资助者	National Natural Science Foundation of China (NSFC) [51471180, 51101161]; Science and Technology Program of Shenyang [F16-205-1-18]
收录类别	SCI
语种	英语
WOS记录号	WOS:000425763100076
引用统计	被引频次：36[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/79464
专题	中国科学院金属研究所
通讯作者	Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
推荐引用方式 GB/T 7714	Zhu, QS,Gao, F,Ma, HC,et al. Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5025-5033.
APA	Zhu, QS.,Gao, F.,Ma, HC.,Liu, ZQ.,Guo, JD.,...&Zhu, QS .(2018).Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(6),5025-5033.
MLA	Zhu, QS,et al."Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.6(2018):5025-5033.