IMR OpenIR
Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via
Sun, FL; Liu, ZQ; Li, CF; Zhu, QS; Zhang, H; Suganuma, K; Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
2018-02-01
Source PublicationMATERIALS
ISSN1996-1944
Volume11Issue:2Pages:-
AbstractThis paper is the first to report a large-scale directcurrent electrodeposition of columnar nanotwinned copper within through silicon via (TSV) with a high aspect ratio (similar to 4). With this newly developed technique, void-free nanotwinned copper array could be fabricated in low current density (30 mA/cm(2)) and convection conditions (300 rpm), which are the preconditions for copper deposition with a uniform deep-hole microstructure. The microstructure of a whole cross-section of deposited copper array was made up of (111) orientated columnar grains with parallel nanoscale twins that had thicknesses of about 22 nm. The hardness was also uniform along the growth direction, with 2.34 and 2.68 GPa for the top and bottom of the TSV, respectively. The gelatin additive is also first reported hereas a key factor in forming nanoscale twins by adsorbing on the cathode surface, in order to enhance the overpotential for cathodic reaction during the copper deposition process.; This paper is the first to report a large-scale directcurrent electrodeposition of columnar nanotwinned copper within through silicon via (TSV) with a high aspect ratio (similar to 4). With this newly developed technique, void-free nanotwinned copper array could be fabricated in low current density (30 mA/cm(2)) and convection conditions (300 rpm), which are the preconditions for copper deposition with a uniform deep-hole microstructure. The microstructure of a whole cross-section of deposited copper array was made up of (111) orientated columnar grains with parallel nanoscale twins that had thicknesses of about 22 nm. The hardness was also uniform along the growth direction, with 2.34 and 2.68 GPa for the top and bottom of the TSV, respectively. The gelatin additive is also first reported hereas a key factor in forming nanoscale twins by adsorbing on the cathode surface, in order to enhance the overpotential for cathodic reaction during the copper deposition process.
description.department[sun, fu-long ; liu, zhi-quan ; li, cai-fu ; zhu, qing-sheng] chinese acad sci, inst met res, shenyang 110016, liaoning, peoples r china ; [sun, fu-long ; liu, zhi-quan] univ chinese acad sci, beijing 100049, peoples r china ; [liu, zhi-quan ; li, cai-fu ; zhang, hao ; suganuma, katsuaki] osaka univ, inst sci & ind res, osaka 5670047, japan
KeywordColumnar-grained Cu Twins Boundaries Nanoscale Strength Behavior Joints
Subject AreaMaterials Science, Multidisciplinary
Funding OrganizationNational Key R&D Program of China [2017YFB0305501]; Natural Science Foundation of China [51401218, 51471180]; Science and Technology Program of Shenyang [F16-205-1-18]; Osaka University Visiting Scholar Program [J135104902]
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/79533
Collection中国科学院金属研究所
Corresponding AuthorLiu, ZQ; Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Recommended Citation
GB/T 7714
Sun, FL,Liu, ZQ,Li, CF,et al. Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via[J]. MATERIALS,2018,11(2):-.
APA Sun, FL.,Liu, ZQ.,Li, CF.,Zhu, QS.,Zhang, H.,...&Liu, ZQ .(2018).Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.MATERIALS,11(2),-.
MLA Sun, FL,et al."Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via".MATERIALS 11.2(2018):-.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Sun, FL]'s Articles
[Liu, ZQ]'s Articles
[Li, CF]'s Articles
Baidu academic
Similar articles in Baidu academic
[Sun, FL]'s Articles
[Liu, ZQ]'s Articles
[Li, CF]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Sun, FL]'s Articles
[Liu, ZQ]'s Articles
[Li, CF]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.