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Effects of minor Sc addition on the microstructure and mechanical properties of 7055 Al alloy during aging
Teng, GB; Liu, CY; Ma, ZY; Zhou, WB; Wei, LL; Chen, Y; Li, J; Mo, YF; Liu, CY (reprint author), Guilin Univ Technol, Key Lab New Proc Technol Nonferrous Met & Mat, Minist Educ, Guilin 541004, Peoples R China.; Ma, ZY (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
2018-01-24
发表期刊MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
卷号713页码:61-66
摘要This study investigated the effects of 0.25% (mass ratio) Sc addition on the microstructure and mechanical properties of 7055 alloy during aging. Sc addition induced a grain boundary effect, which refined the grains of the 7055 alloy. Sc addition also increased the precipitation nucleation efficiency and promoted the uniform precipitation of the eta' phase of 7055 alloy during aging. Compared with pure 7055 alloy, 7055 alloy with Sc exhibited improved hardness, tensile strength, ductility, and thermal stability. This improvement was attributed to the finer size, higher density, more uniformly distributed eta' phase, less eta phase, and finer Al grains of 7055 alloy with Sc compared with those of 7055 alloy without Sc.; This study investigated the effects of 0.25% (mass ratio) Sc addition on the microstructure and mechanical properties of 7055 alloy during aging. Sc addition induced a grain boundary effect, which refined the grains of the 7055 alloy. Sc addition also increased the precipitation nucleation efficiency and promoted the uniform precipitation of the eta' phase of 7055 alloy during aging. Compared with pure 7055 alloy, 7055 alloy with Sc exhibited improved hardness, tensile strength, ductility, and thermal stability. This improvement was attributed to the finer size, higher density, more uniformly distributed eta' phase, less eta phase, and finer Al grains of 7055 alloy with Sc compared with those of 7055 alloy without Sc.
部门归属[teng, g. b. ; liu, c. y. ; wei, l. l. ; chen, y.] guilin univ technol, key lab new proc technol nonferrous met & mat, minist educ, guilin 541004, peoples r china ; [liu, c. y. ; ma, z. y.] chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, liaoning, peoples r china ; [zhou, w. b. ; li, j. ; mo, y. f.] alnan aluminium co ltd, nanning 530000, peoples r china
关键词Mg-cu Alloy Stress-corrosion Cracking Aluminum-alloy Precipitation Behaviors Tensile Properties Pre-strain Zr Alloy Evolution Strength 7055-aluminum-alloy
学科领域Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
资助者National Natural Science Foundation of China [51601045]; Guangxi "Bagui" Teams for Innovation and Research; Research Program of Science and Technology of Guangxi [GKAB16380021]
收录类别SCI
语种英语
WOS记录号WOS:000425557900008
引用统计
被引频次:83[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/79567
专题中国科学院金属研究所
通讯作者Liu, CY (reprint author), Guilin Univ Technol, Key Lab New Proc Technol Nonferrous Met & Mat, Minist Educ, Guilin 541004, Peoples R China.; Ma, ZY (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
推荐引用方式
GB/T 7714
Teng, GB,Liu, CY,Ma, ZY,et al. Effects of minor Sc addition on the microstructure and mechanical properties of 7055 Al alloy during aging[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2018,713:61-66.
APA Teng, GB.,Liu, CY.,Ma, ZY.,Zhou, WB.,Wei, LL.,...&Ma, ZY .(2018).Effects of minor Sc addition on the microstructure and mechanical properties of 7055 Al alloy during aging.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,713,61-66.
MLA Teng, GB,et al."Effects of minor Sc addition on the microstructure and mechanical properties of 7055 Al alloy during aging".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 713(2018):61-66.
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