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FCBGA器件SnAgCu焊点的热冲击可靠性分析
姜楠; 张亮; 刘志权; 熊明月; 龙伟民
2019
Source Publication焊接学报
Volume40Issue:09Pages:39-42+162
Abstract采用有限元法和Garofalo-Arrheninus稳态本构方程,在热冲击条件下对倒装芯片球栅阵列封装(FCBGA)器件SnAgCu焊点的可靠性进行分析.结果表明,Sn3.9Ag0.6Cu焊点的可靠性相对较高.通过分析SnAgCu焊点的力学本构行为,发现焊点应力的最大值出现在焊点与芯片接触的阵列拐角处.随着时间的推移,SnAgCu焊点的应力呈周期性变化. Sn3.9Ag0.6Cu的焊点应力和蠕变最小,Sn3.8Ag0.7Cu焊点应力和蠕变次之,Sn3.0Ag0.5Cu焊点应力和蠕变最大,与实际的FCBGA器件试验结果一致.基于蠕变应变疲劳寿命预测方程预测三种SnAgCu焊点的疲劳寿命,发现Sn3.9Ag0.6Cu焊点的疲劳寿命比Sn3.0Ag0.5Cu和Sn3.8Ag0.7Cu焊点的疲劳寿命高.
Keyword有限元法 热冲击 焊点 可靠性 疲劳寿命
MOST Discipline CatalogueTG404
Language中文
WOS SubjectTG404
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80458
Collection中国科学院金属研究所
Affiliation1.江苏师范大学
2.中国科学院金属研究所
3.郑州机械研究所新型钎焊材料与技术国家重点实验室
Recommended Citation
GB/T 7714
姜楠,张亮,刘志权,等. FCBGA器件SnAgCu焊点的热冲击可靠性分析[J]. 焊接学报,2019,40(09):39-42+162.
APA 姜楠,张亮,刘志权,熊明月,&龙伟民.(2019).FCBGA器件SnAgCu焊点的热冲击可靠性分析.焊接学报,40(09),39-42+162.
MLA 姜楠,et al."FCBGA器件SnAgCu焊点的热冲击可靠性分析".焊接学报 40.09(2019):39-42+162.
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