| Anand constitutive model of lead-free solder joints in 3D IC device | |
| Zhang,Liang1,2; Liu,Zhi-quan2; Ji,Yu-tong3 | |
| 2016-08-01 | |
| 发表期刊 | Journal of Physics: Conference Series
 |
| ISSN | 1742-6588 |
| 卷号 | 738期号:1 |
| 摘要 | Abstract Anand constitutive relation of SnAgCu and SnAgCu-nano Al solders were studied under uniaxial tension, and the constitutive model was used in the finite element simulation to analyze the stress-strain response of lead-free solder joints in 3D IC devices. The results showed that the nine parameters of the Anand model can be determined from separated constitutive relations and experimental results. Based on Anand model, the finite element method was selected to calculate the stress-strain response of lead-free solder joints, it was found that in the 3D IC device the maximum stress-strain concentrated in the concern solder joints, the stress-strain of SnAgCu-nano Al solder joints was lower than that of SnAgCu solder joints, which represented that the addition of nano Al particles can enhance the reliability of lead-free solder joints in 3D IC devices. |
| DOI | 10.1088/1742-6596/738/1/012050 |
| 语种 | 英语 |
| WOS记录号 | IOP:1742-6588-738-1-012050 |
| 出版者 | IOP Publishing |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/80485 |
| 专题 | 中国科学院金属研究所 |
| 作者单位 | 1.School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China 2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China 3.School of Information and Art, Jiangsu Vocational Institute of Architectural Technology, Xuzhou 221116, China |
| 推荐引用方式 GB/T 7714 | Zhang,Liang,Liu,Zhi-quan,Ji,Yu-tong. Anand constitutive model of lead-free solder joints in 3D IC device[J]. Journal of Physics: Conference Series,2016,738(1). |
| APA | Zhang,Liang,Liu,Zhi-quan,&Ji,Yu-tong.(2016).Anand constitutive model of lead-free solder joints in 3D IC device.Journal of Physics: Conference Series,738(1). |
| MLA | Zhang,Liang,et al."Anand constitutive model of lead-free solder joints in 3D IC device".Journal of Physics: Conference Series 738.1(2016). |
| 条目包含的文件 | 条目无相关文件。 | |||||
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