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Anand constitutive model of lead-free solder joints in 3D IC device
Zhang,Liang1,2; Liu,Zhi-quan2; Ji,Yu-tong3
2016-08-01
发表期刊Journal of Physics: Conference Series
ISSN1742-6588
卷号738期号:1
摘要Abstract Anand constitutive relation of SnAgCu and SnAgCu-nano Al solders were studied under uniaxial tension, and the constitutive model was used in the finite element simulation to analyze the stress-strain response of lead-free solder joints in 3D IC devices. The results showed that the nine parameters of the Anand model can be determined from separated constitutive relations and experimental results. Based on Anand model, the finite element method was selected to calculate the stress-strain response of lead-free solder joints, it was found that in the 3D IC device the maximum stress-strain concentrated in the concern solder joints, the stress-strain of SnAgCu-nano Al solder joints was lower than that of SnAgCu solder joints, which represented that the addition of nano Al particles can enhance the reliability of lead-free solder joints in 3D IC devices.
DOI10.1088/1742-6596/738/1/012050
语种英语
WOS记录号IOP:1742-6588-738-1-012050
出版者IOP Publishing
引用统计
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/80485
专题中国科学院金属研究所
作者单位1.School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China
3.School of Information and Art, Jiangsu Vocational Institute of Architectural Technology, Xuzhou 221116, China
推荐引用方式
GB/T 7714
Zhang,Liang,Liu,Zhi-quan,Ji,Yu-tong. Anand constitutive model of lead-free solder joints in 3D IC device[J]. Journal of Physics: Conference Series,2016,738(1).
APA Zhang,Liang,Liu,Zhi-quan,&Ji,Yu-tong.(2016).Anand constitutive model of lead-free solder joints in 3D IC device.Journal of Physics: Conference Series,738(1).
MLA Zhang,Liang,et al."Anand constitutive model of lead-free solder joints in 3D IC device".Journal of Physics: Conference Series 738.1(2016).
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